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AL9901FDF-13 датащи(PDF) 4 Page - Diodes Incorporated

номер детали AL9901FDF-13
подробное описание детали  UNIVERSAL HIGH VOLTAGE LED DRIVER
PDF  20 Pages
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производитель  DIODES [Diodes Incorporated]
домашняя страница  http://www.diodes.com
Logo DIODES - Diodes Incorporated

AL9901FDF-13 датащи(HTML) 4 Page - Diodes Incorporated

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AL9901
Document number: DS37713 Rev. 1 - 2
4 of 20
www.diodes.com
March 2015
© Diodes Incorporated
AL9901
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Specifications apply to AL9901 unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IInsd
Shut-Down Mode Supply Current
Pin PWM_D to GND,
VIN = 15V
-
0.5
1
mA
VDD
Internally Regulated Voltage
VIN = VIN(MIN)~ 500V, (Note 8) lDD(ext) = 0,
Gate pin open
7.2
7.5
8.1
V
IDD(ext)
VDD Current Available for External Circuitry VIN = 15 to 100V (Note 7)
-
-
1.0
mA
UVLO
VDD Under Voltage Lockout Threshold
VDD rising
6.4
6.7
7.2
V
UVLO
VDD Under Voltage Lockout Hysteresis
VDD falling
-
500
-
mV
RPWM_D
PWM_D Pull-Down Resistance
VPWM_D= 5V
150
200
250
k
VT
MOSFET Threshold Voltage
ISW = 0.5A
-
3
-
V
VFD
MOSFET Diodes Forward Voltage
ID = 0.5A
-
0.85
-
V
RDS(ON)
Drain-Source On-Resistance
-
-
4.4
-
VCS(hi)
Current Sense Threshold Voltage
TA = -40°C to +125°C
237.5
250
262.5
mV
fOSC
Oscillator Frequency
ROSC = 1M
20
25
30
kHz
ROSC = 226k
80
100
120
DMAXhf
Maximum Oscillator PWM Duty Cycle
fPWMhf = 25kHz, at GATE, CS to GND.
-
-
100
%
VLD
Linear Dimming Pin Voltage Range
TA = <125°C, VIN = 15V
0
-
250
mV
tBLANK
Current Sense Blanking Interval
VCS = 0.45V, VLD = VDD
160
250
440
ns
tDELAY
Delay From CS Trip to GATE lo
VIN = 15V, VLD = 0.15,
VCS = 0 to 0.22V after TBLANK
-
-
300
ns
TSD
Thermal Shut-Down
-
-
+150
-
°C
TSDH
Thermal Shut-Down Hysteresis
-
-
+50
-
θJA
Thermal Resistance Junction-to-Ambient
U-DFN6040-12 (Note 8)
-
65
-
°C/W
θJC
Thermal Resistance Junction-to-Case
-
5
-
°C/W
θJA
Thermal Resistance Junction-to-Ambient
SOIC-16
-
100
-
°C/W
θJC
Thermal Resistance Junction-to-Case
-
15
-
°C/W
Notes:
7. Also limited by package power dissipation capability, whichever is lower.
8. Device mounted on FR-4 PCB (25mm x 25mm 1oz copper, minimum recommended pad layout on top. For better thermal performance, larger
copper pad for heat-sink is needed.



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