TAS5760LDAPR datasheet(7/77 Pages) TI1

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TAS5760L

www.ti.com

SLOS782B – JULY 2013 – REVISED SEPTEMBER 2015

Pin Functions (continued)

TAS5760L

INTERNAL

NO.

TYPE(1)

DESCRIPTION

TERMINATION

NAME

22,

Ground for power device circuitry (NOTE: This terminal should be connected to

PGND

the system ground)

21,

PVDD

Power Supply for internal power circuitry

Bit clock for the digital signal that is active on the serial data port's input data

SCLK

Weak Pull-Down

line

SDIN

Weak Pull-Down

Data line to the serial data port

SFT_CLIP

Sets the maximum output voltage before clipping

SPK_FAULT

Open Drain

Fault terminal, which is pulled LOW when an internal fault occurs

SPK_GAIN0

Weak Pull-Down

Adjusts the LSB of the multi-bit gain of the speaker amplifier

SPK_GAIN1

Weak Pull-Down

Adjusts the MSB of the multi-bit gain of the speaker amplifier

SPK_SLEEP/

Weak Pull-Up

Places the speaker amplifier in mute

ADR

SPK_OUTA-

Negative terminal for differential speaker amplifier output A

SPK_OUTA+

Positive terminal for differential speaker amplifier output A

SPK_OUTB-

Negative terminal for differential speaker amplifier output B

SPK_OUTB+

Positive terminal for differential speaker amplifier output B

SPK_SD

Places the device in shutdown when pulled LOW

VCOM

Bias voltage for internal PWM conversion block

Provides both electrical and thermal connection from the device to the board. A

PowerPAD™

matching ground pad must be provided on the PCB and the device connected

to it via solder

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Ambient Operating Temperature, TA

–25

°C

Temperature

Ambient Storage Temperature, TS

–40

125

°C

AVDD Supply

–0.3

Supply Voltage

PVDD Supply

–0.3

DVDD Supply

–0.3

DVDD Referenced Digital

Digital Inputs referenced to DVDD supply

–0.5

DVDD + 0.5

Input Voltages

Speaker Amplifier Output

VSPK_OUTxx, measured at the output pin

–0.3

Voltage

Storage temperature range, Tstg

–40

125

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

4000

V(ESD)

Electrostatic discharge

Charged-device model (CDM), per JEDEC specification JESD22-

1500

C101(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

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