LAMINATE

Data Sheet

Questions? Contact us: marketing@amkor.com

Visit Amkor Technology online for locations and

to view the most current product information.

DS831C

Rev Date: 9/15

Features

• Die sizes up to 26 mm

• Package sizes from 10 mm to 55 mm (60 mm and 65 mm in development)

• 0.4 mm, 0.5 mm, 0.65 mm, 0.8 mm and 1.0 mm pitch BGA footprints

• 130 µm minimum array bump pitch

• < 100 µm minimum peripheral bump pitch

Technology Options

• Substrates

– 4-16 layer laminate build up substrates

– High CTE ceramic

– LTCC alumina ceramic

– Coreless

• Bump Types

– Eutectic Sn/Pb

– High Pb

– Pb Free

– Cu pillar (array and fine pitch peripheral)

• Package Formats

– Bare die

– Lidded

Thermal Solutions

The variety of FCBGA package options allows package selection to be

tailored to the specific thermal needs of the end product. High performance

ASIC products typically utilize a lidded format that features a controlled

bondline die attach direct to a copper heat spreader. This feature produces

the lowest possible thermal resistance (Theta JC) between the package and

any externally applied thermal solution. The copper heat spreader effectively

spreads heat laterally away from the die to the package perimeter and into

the motherboard.

Lower wattage products generally utilize bare die or molded configurations.

In these cases, the flip chip construction, with solder bumps and core vias,

provides a lower resistance path from the active side of the die through the

substrate, allowing heat dissipation both from the package surface and into

the motherboard.

Flip Chip BGA Packages (FCBGA)

Flip chip interconnect utilizes array interconnect of die to

substrate as a replacement for conventional wire bonding.

This allows the entire die surface to be used for electrical

connections to the substrate, exponentially increasing the

I/O per unit area vs. perimeter interconnect technologies.

Using flip chip interconnect improves package electrical

performance by removing the high inductance wires and

replacing them with low inductance solder connections. Flip

chip interconnect also allows highly parallel, direct

connection with on-die power planes, which enables

performance at lower operating voltages.

Amkor FCBGA packages are assembled around

state-of-the-art, single unit laminate or ceramic substrates.

Utilizing multiple high density routing layers, laser drilled

blind, buried, and stacked vias, and ultra fine line/space

metallization, FCBGA substrates have the highest routing

density available. By combining flip chip interconnect with

ultra advanced substrate technology, FCBGA packages can

be electrically tuned for maximum electrical performance.

Once the electrical function is defined, the design flexibility

enabled by flip chip also allows for significant options in

final package design. Amkor offers FCBGA packaging in a

variety of product formats to fit a wide range of end

application requirements.

Applications

This IC packaging technology is applicable for high pincount

and/or high performance ASICs. Large body FCBGAs

provide package solutions for the demands of internet,

workstation processors and high bandwidth system

communication devices. By incorporating flip chip

interconnect technology, packages supporting thousands of

connections are enabled in conventional surface mount

package sizes. FCBGAs are also the package of choice for

gaming system processors and graphics, as well as

high-end applications processors for leading-edge portable

devices.

FCBGA