FCBGA датащи(PDF) - Amkor Technology

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FCBGA датащи (PDF) - Amkor Technology

FCBGA Datasheet PDF - Amkor Technology


номер детали	FCBGA

скачать	FCBGA скачать

объем файла	422.27 Kbytes

Page	2 Pages

производитель	AMKOR [Amkor Technology]

домашняя страница	http://www.amkor.com

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подробное описание детали

Package sizes from 10 mm to 55 mm (60 mm and 65 mm in development)

FCBGA Datasheet (PDF)

Go To PDF Page

скачать датащи

FCBGA Datasheet PDF - Amkor Technology


номер детали	FCBGA

скачать	FCBGA Click to download

объем файла	422.27 Kbytes

Page	2 Pages

производитель	AMKOR [Amkor Technology]

домашняя страница	http://www.amkor.com

Logo

подробное описание детали	Package sizes from 10 mm to 55 mm (60 mm and 65 mm in development)

FCBGA датащи (HTML) - Amkor Technology

FCBGA Datasheet HTML 1Page - Amkor Technology

FCBGA Datasheet HTML 2Page - Amkor Technology

Аналогичный номер детали - FCBGA

производитель	номер детали	датащи	подробное описание детали
Amkor Technology	FCBGA	772Kb / 2P	Amkor FCBGA packages are assembled around state‑of‑the‑art, single unit laminate or ceramic substrates. 12/20

Аналогичное описание - FCBGA

производитель	номер детали	датащи	подробное описание детали
Vishay Siliconix	82325	98Kb / 2P	Package Dimensions in mm 02-Aug-04
	PM2IV1	122Kb / 2P	Package Dimensions in mm 28-Jul-04
	PM1CB1	101Kb / 2P	Package Dimensions in mm 27-Jul-04
	PM2VI1	45Kb / 2P	Package Dimensions in mm 02-Aug-04
	SOT-363L	39Kb / 2P	Package Dimensions in mm 10-Feb-04
	82186	106Kb / 2P	Package Dimensions in mm 28-Jul-04
	SOT-490	35Kb / 2P	Package Dimensions in mm 06-Sep-04
	PM2KU1	102Kb / 2P	Package Dimensions in mm 28-Jul-04
	PM2SL1	93Kb / 2P	Package Dimensions in mm 30-Jul-04
Pulse A Technitrol Comp...	GPSMODXXXX	750Kb / 10P	Active GPS Antenna Modules 13mm x 13 mm and 25 mm x 25 mm sizes

О Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Эта информация предназначена только для общих информационных целей, мы не несем ответственности за любые убытки или ущерб, вызванные вышеуказанной информацией.

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