ADR1

SCL

SDA

AGND

V+

DRDY

Two-Wire

Controller

A3

B1

C2

B3

C3

A2

TMP006

2.5 V to 5.5 V

0.01 µF

ADR0

C1

DGND

A1

10 k

10 k

10 k

V+

TMP006, TMP006B

www.ti.com

SBOS518E – MAY 2011 – REVISED APRIL 2015

9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

9.1 Application Information

The TMP006 and TMP006B are a complete IR thermopile sensor system on a chip that includes the sensing

element, signal conditioner, and ADC. These devices are ideal for applications where the object cannot be

placed in thermal contact with a conventional temperature sensor. Common reasons for noncontact temperature

sensing are:

•

Distance; the object is too far away, or in an inconvenient location for wired connections.

•

The object is in motion.

•

Direct contact of the object is inconvenient or uncomfortable (for example, skin).

•

The object is a fluid (that is, liquid or gas).

•

The object is hazardous (for example, acid or flammable).

•

The object is in a hazardous state (for example, high voltage).

9.2 Typical Application

Figure 19. Typical Application Circuit

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Product Folder Links: TMP006 TMP006B