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DTO25 датащи(PDF) 2 Page - Vishay Siliconix |
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DTO25 датащи(HTML) 2 Page - Vishay Siliconix |
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2 / 6 page ![]() DTO25 www.vishay.com Vishay Sfernice Revision: 23-Sep-15 2 Document Number: 51054 For technical questions, contact: sferfixedresistors@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SPECIAL FEATURES Resistance Values ≥ 0.016 ≥ 0.1 ≥ 0.5 Requirement Temperature Coefficient (TCR) (-55 °C +150 °C) IEC 60115-1 ± 900 ppm/°C ± 350 ppm/°C ± 150 ppm/°C PERFORMANCE TESTS CONDITIONS REQUIREMENTS Momentary Overload IEC 60115-1 §4.13 1.6 Pr 5 s US < 1.5 UL ± (0.25 % + 0.005 Ω) Load Life IEC 60115-1 1000 h, 90/30 Pr at +25 °C ± (1 % + 0.005 Ω) High Temperature Exposure AEC-Q200 REV D conditions: MIL-STD-202 method 108 1000 h, +175 °C, unpowered ± (1 % + 0.005 Ω) Temperature Cycling AEC-Q200 REV D conditions: pre-conditioning 3 reflows according JESTD020D JESD22 method JA-104 1000 cycles, (-55 °C to +125 °C) dwell time 15 min ± (0.5 % + 0.005 Ω) Biased Humidity AEC-Q200 REV D conditions: MIL-STD-202 method 103 1000 h, 85°C, 85 % RH ± (0.5 % + 0.005 Ω) Operational Life AEC-Q200 REV D conditions: pre-conditioning 3 reflows according JESTD020D MIL-STD-202 method 108 1000 h, 90/30, powered, +125 °C ± (1 % + 0.005 Ω) ESD Human Body Model AEC-Q200 REV D conditions: AEC-Q200-002 25 kVAD ± (0.5 % + 0.005 Ω) Vibration AEC-Q200 REV D conditions: MIL-STD-202 method 204 5 g’s for 20 min, 12 cycles test from 10 Hz to 2000 Hz ± (0.5 % + 0.005 Ω) Mechanical Shock AEC-Q200 REV D conditions: MIL-STD-202 method 213 100 g’s, 6 ms, 3.75 m/s 3 shocks/direction ± (0.5 % + 0.005 Ω) Board Flex AEC-Q200 REV D conditions: AEC-Q200-005 bending 2 mm, 60 s ± (0.25 % + 0.01 Ω) Terminal Strength AEC-Q200 REV D conditions: AEC-Q200-006 1.8 kgf, 60 s ± (0.25 % + 0.01 Ω) ASSEMBLY SPECIFICATIONS For the assembly on board, we recommend the lead (Pb)-free thermal profile as per J-STD-020C TESTS CONDITIONS REQUIREMENTS Resistance to Soldering Heat AEC-Q200 REV D MIL-STD-202 method 210 Solder Bath method: 270 °C / 10 s ± (0.5 % + 0.005 Ω) Moisture Sensitivity Level (MSL) IPC / JEDEC® J-STD-020C 85 °C / 85 % RH / 168 h Level: 1 + pass requirements of TCR Overload and Dielectic Strength after MSL |
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