ML2340, ML2350

12

Micro Linear reserves the right to make changes to any product herein to improve reliability, function or design.

Micro Linear does not assume any liability arising out of the application or use of any product described herein,

neither does it convey any license under its patent right nor the rights of others. The circuits contained in this

data sheet are offered as possible applications only. Micro Linear makes no warranties or representations as to

whether the illustrated circuits infringe any intellectual property rights of others, and will accept no responsibility

or liability for use of any application herein. The customer is urged to consult with appropriate legal counsel

before deciding on a particular application.

DS2340_50-01

2092 Concourse Drive

San Jose, CA 95131

Tel: 408/433-5200

Fax: 408/432-0295

ORDERING INFORMATION

INTEGRAL & DIFFERENTIAL

TEMPERATURE

PART NUMBER

NON-LINEARITY

RANGE

PACKAGE

ML2340CCP/5 (OBS)

±1/2 LSB

0°C to 70°C

Molded DIP (P18)

ML2340CCS/5 (OBS)

0°C to 70°C

Molded SOIC (S18)

ML2350CCP/5 (OBS)

±1/2 LSB

0°C to 70°C

Molded DIP (P18)

ML2350CCS/5 (EOL)

0°C to 70°C

Molded SOIC (S18)

ML2350CIS/5 (EOL)

–40°C to 85°C

Molded SOIC (S18)

ML2340CCP/12 (OBS)

±1/2 LSB

0°C to 70°C

Molded DIP (P18)

ML2340CCS/12 (OBS)

0°C to 70°C

Molded SOIC (S18)

ML2350CCP/12 (OBS)

±1/2 LSB

0°C to 70°C

Molded DIP (P18)

ML2350CCS/12 (OBS)

0°C to 70°C

Molded SOIC (S18)

ML2350CIS/12 (OBS)

–40°C to 85°C

Molded SOIC (S18)

© Micro Linear 1997

is a registered trademark of Micro Linear Corporation

Products described in this document may be covered by one or more of the following patents, U.S.: 4,897,611; 4,964,026; 5,027,116; 5,281,862; 5,283,483; 5,418,502; 5,508,570; 5,510,727; 5,523,940;

5,546,017; 5,559,470; 5,565,761; 5,592,128; 5,594,376; Japan: 2598946; 2619299. Other patents are pending.