LP3961 datasheet(4/31 Pages) TI

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LP3961, LP3964

SNVS056J – MAY 2000 – REVISED JUNE 2015

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6 Specifications

6.1 Absolute Maximum Ratings

(1) (2)

MIN

MAX

UNIT

Power dissipation(3)

Internally Limited

Input Supply Voltage (Survival)

−0.3

7.5

Shutdown Input Voltage (Survival)

−0.3

VIN + 0.3

Output Voltage (Survival)(4), (5)

−0.3

7.5

IOUT (Survival)

Short-Circuit Protected

Maximum Voltage for ERROR pin

VIN + 0.3

Maximum Voltage for SENSE pin

VOUT + 0.3

Storage temperature, Tstg

–65

150

°C

(1)

Absolute maximum ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate

conditions for which the device is intended to be functional, but does not ensure specific performance limits. For ensured specifications

and test conditions, see Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some

performance characteristics may degrade when the device is not operated under the listed test conditions.

(2)

If Military- or Aerospace-specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(3)

The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal

resistance, RθJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated

using: P(MAX) = (TJ(MAX) – TA) / RθJA.

(4)

If used in a dual-supply system where the regulator load is returned to a negative supply, the LP396X output must be diode-clamped to

ground.

(5)

The output PMOS structure contains a diode between the IN and OUT pins. This diode is normally reverse biased. This diode will get

forward biased if the voltage at the OUT pin is forced to be higher than the voltage at the IN pin. This diode can typically withstand 200

mA of DC current and 1 A of peak current.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process..

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

Input supply voltage (operating)(1)

2.5

Shutdown input voltage (operating)

−0.3

VIN + 0.3

Maximum operating current (DC)

0.8

Operating junction temperature

−40

125

°C

(1)

The minimum operating value for VIN is equal to either [VOUT(NOM) + VDROPOUT] or 2.5 V, whichever is greater.

6.4 Thermal Information

LP3961, LP3964

LP3964

THERMAL METRIC(1)

NDC

KTT

NDH

UNIT

5 PINS

RθJA

Junction-to-ambient thermal resistance

65.2

40.3

32.1

RθJC(top)

Junction-to-case (top) thermal resistance

47.2

43.4

43.8

RθJB

Junction-to-board thermal resistance

9.9

23.1

18.7

°C/W

ψJT

Junction-to-top characterization parameter

3.4

11.5

8.8

ψJB

Junction-to-board characterization parameter

9.7

22.1

18.0

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

1.0

1.3

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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