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PMZB200UNE датащи(PDF) 4 Page - NXP Semiconductors |
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PMZB200UNE датащи(HTML) 4 Page - NXP Semiconductors |
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4 / 14 page ![]() NXP Semiconductors PMZB200UNE 30 V, N-channel Trench MOSFET PMZB200UNE All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved Product data sheet 12 March 2015 4 / 14 aaa-016973 VDS (V) 10-1 102 10 1 1 10-1 10 ID (A) 10-2 Limit RDSon = VDS/ID DC; Tsp = 25 °C DC; Tamb = 25 °C; drain mounting pad 1 cm2 tp = 10 µs tp = 100 µs tp = 1 ms tp = 100 ms tp = 10 ms IDM = single pulse Fig. 4. Safe operating area; junction to ambient; continuous and peak drain currents as a function of drain- source voltage 9. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit [1] - 315 360 K/W Rth(j-a) thermal resistance from junction to ambient in free air [2] - 145 165 K/W Rth(j-sp) thermal resistance from junction to solder point - 17 20 K/W [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for drain 1 cm2. |
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