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MAX5041AEAI датащи(PDF) 25 Page - Maxim Integrated Products |
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MAX5041AEAI датащи(HTML) 25 Page - Maxim Integrated Products |
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25 / 26 page ![]() Dual-Phase, Parallelable, Average-Current-Mode Controllers ______________________________________________________________________________________ 25 CCF provides a low-frequency pole while RCF provides a midband zero. Place a zero (fZ) to obtain a phase bump at the crossover frequency. Place a high-frequency pole (fP) at least a decade away from the crossover frequency to reduce the influence of the switching noise and achieve maximum phase margin. Use the following equations to calculate CCF and CCFF: PC Board Layout Use the following guidelines to lay out the switching voltage regulator: 1) Place the VIN and VCC bypass capacitors close to the MAX5038A/MAX5041A. 2) Minimize the area and length of the high-current loops from the input capacitor, upper switching MOSFET, inductor, and output capacitor back to the input capacitor negative terminal. 3) Keep short the current loop formed by the lower switching MOSFET, inductor, and output capacitor. 4) Place the Schottky diodes close to the lower MOSFETs and on the same side of the PC board. 5) Keep the SGND and PGND isolated and connect them at one single point close to the negative termi- nal of the input filter capacitor. 6) Run the current-sense lines CS+ and CS- very close to each other to minimize the loop area. Similarly, run the remote voltage sense lines SENSE+ and SENSE- close to each other. Do not cross these critical signal lines through power cir- cuitry. Sense the current right at the pads of the current-sense resistors. 7) Avoid long traces between the VCC bypass capaci- tors, driver output of the MAX5038A/MAX5041A, MOSFET gates, and PGND. Minimize the loop formed by the VCC bypass capacitors, bootstrap diode, bootstrap capacitor, MAX5038A/MAX5041A, and upper MOSFET gate. 8) Place the bank of output capacitors close to the load. 9) Distribute the power components evenly across the board for proper heat dissipation. 10) Provide enough copper area at and around the switching MOSFETs, inductor, and sense resistors to aid in thermal dissipation. 11) Use 4oz copper to keep the trace inductance and resistance to a minimum. Thin copper PC boards can compromise efficiency since high currents are involved in the application. Also, thicker copper conducts heat more effectively, thereby reducing thermal impedance. Chip Information TRANSISTOR COUNT: 5431 PROCESS: BiCMOS C fR CFF PCF = ×× × 1 2 π C fR CF ZCF = ×× × 1 2 π 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 CLKIN CLKOUT BST2 DH2 LX2 DL2 EN PGND IN VCC DL1 LX1 DH1 BST1 CSN1 CSP1 EAOUT EAN DIFF SENSE- SENSE+ CLP1 SGND CLP2 PLLCMP PHASE CSN2 CSP2 SSOP TOP VIEW MAX5038A MAX5041A Pin Configuration (31) (32) |
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