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TLV707P датащи(PDF) 2 Page - Texas Instruments |
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TLV707P датащи(HTML) 2 Page - Texas Instruments |
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2 / 42 page ![]() TLV707, TLV707P SBVS153D – FEBRUARY 2011 – REVISED JANUARY 2015 www.ti.com Table of Contents 8.4 Device Functional Modes........................................ 19 1 Features .................................................................. 1 9 Application and Implementation ........................ 20 2 Applications ........................................................... 1 9.1 Application Information............................................ 20 3 Description ............................................................. 1 9.2 Typical Application .................................................. 20 4 Typical Application Circuit (Fixed-Voltage 9.3 Do's and Don'ts ....................................................... 22 Versions)................................................................. 1 10 Power Supply Recommendations ..................... 23 5 Revision History..................................................... 2 11 Layout................................................................... 23 6 Pin Configuration and Functions ......................... 4 11.1 Layout Guidelines ................................................. 23 7 Specifications......................................................... 5 11.2 Layout Example .................................................... 23 7.1 Absolute Maximum Ratings ...................................... 5 11.3 Thermal Considerations ........................................ 23 7.2 ESD Ratings.............................................................. 5 11.4 Power Dissipation ................................................. 24 7.3 Recommended Operating Conditions ....................... 5 12 Device and Documentation Support ................. 25 7.4 Thermal Information .................................................. 5 12.1 Device Support...................................................... 25 7.5 Electrical Characteristics........................................... 6 12.2 Documentation Support ........................................ 25 7.6 Typical Characteristics .............................................. 7 12.3 Trademarks ........................................................... 25 8 Detailed Description ............................................ 17 12.4 Electrostatic Discharge Caution ............................ 25 8.1 Overview ................................................................. 17 12.5 Glossary ................................................................ 25 8.2 Functional Block Diagrams ..................................... 17 13 Mechanical, Packaging, and Orderable 8.3 Feature Description................................................. 18 Information ........................................................... 25 5 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (November 2012) to Revision D Page • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ................................................................................................. 1 • Changed references to DFN (SON) package to DQN (X2SON) throughout document ........................................................ 1 • Changed Features list bullets ................................................................................................................................................ 1 • Changed fourth paragraph of Description section ................................................................................................................. 1 • Changed Pin Descriptions table contents ............................................................................................................................. 4 • Changed Overview section .................................................................................................................................................. 17 • Changed Internal Current Limit section ............................................................................................................................... 18 • Changed Input and Output Capacitor Requirements section .............................................................................................. 20 Changes from Revision B (October 2011) to Revision C Page • Changed voltage range in fourth Features bullet ................................................................................................................... 1 • Changed front page pinout drawing ....................................................................................................................................... 1 • Changed Output voltage range parameter minimum specification in Electrical Characteristics table ................................... 6 • Changed DC output accuracy parameter test conditions in Electrical Characteristics table ................................................. 6 • Changed voltage range in footnote 2 of Ordering Information table .................................................................................... 25 Changes from Revision A (August 2011) to Revision B Page • Deleted reference to DCK package from Features ................................................................................................................ 1 • Deleted DCK package pinout drawing.................................................................................................................................... 1 • Deleted column for DCK package from Pin Descriptions table.............................................................................................. 4 • Deleted DCK package from Thermal Information table.......................................................................................................... 5 2 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated |
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