3.0V to 5.5V, 1.25Gbps/2.5Gbps

LAN Laser Drivers

18

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The modulator is not needed. Leave TC and MODSET

open. Connect IN+ to VCC, IN- to REF, and leave OUT+

and OUT– open.

Wirebonding Die

The MAX3286/MAX3296 series uses bondpads with gold

metalization. Make connections to the die with gold wire

only, using ball-bonding techniques. Wedge bonding is

not recommended. Bondpad size is 4 mil square. Die

thickness is typically 15 mils (0.38mm).

Interface Models

Figures 14–18 show typical input/output models for the

MAX3286/MAX3296 series of laser drivers. If dice are

used, replace the package parasitic elements with

bondwire parasitic elements.

4kΩ

2.5kΩ

FAULT, FAULT, POR

MAX3286

MAX3296

Figure 14. Logic Outputs

10kΩ

550Ω

60Ω

SHDNDRV

MAX3286

MAX3296

Figure 15. SHDNDRV Output

PACKAGE

1.5nH

OUT-

0.2pF

1.5nH

0.2pF

OUT+

50Ω

50Ω

PACKAGE

1pF

1pF

Figure 16. Modulator Outputs