BCP53_BCX53_BC53PA

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© NXP B.V. 2011. All rights reserved.

Product data sheet

Rev. 9 — 19 October 2011

16 of 22

NXP Semiconductors

BCP53; BCX53; BC53PA

80 V, 1 A PNP medium power transistors

11. Soldering

Fig 22. Reflow soldering footprint SOT223 (SC-73)

Fig 23. Wave soldering footprint SOT223 (SC-73)

sot223_fr

1.2

(4

×)

1.2

(3

×)

1.3

(4

×)

1.3

(3

×)

6.15

7

3.85

3.6

3.5

0.3

3.9

7.65

2.3

2.3

6.1

4

23

1

solder lands

solder resist

occupied area

solder paste

Dimensions in mm

sot223_fw

1.9

6.7

8.9

8.7

1.9

(3

×)

1.9

(2

×)

1.1

6.2

2.7

2.7

2

4

3

1

solder lands

solder resist

occupied area

preferred transport

direction during soldering

Dimensions in mm