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LTC1695CS5 датащи(PDF) 14 Page - Linear Technology |
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LTC1695CS5 датащи(HTML) 14 Page - Linear Technology |
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14 / 20 page ![]() LTC1695 14 Thermal Considerations The LTC1695’s power handling capability is limited by the maximum rated junction temperature of 125 °C. Power dissipation (PDISS) consists of two components: 1. Output current multiplied by the input/output voltage differential: (ILOAD)(VCC – VOUT), and 2. GND pin current multiplied by the input voltage: (IGND)(VCC). PDISS = (ILOAD)(VCC – VOUT) + (IGND)(VCC) TJ = PDISS • (θJA) The LTC1695 has active current limiting and thermal shutdown circuitry for device protection during overload or fault condition. For continuous overload conditions, do not exceed the 125 °C maximum junction temperature TJ(MAX). Give careful consideration to all thermal resis- tance sources from junction to ambient. Consider any additional heat sources mounted in proximity to the LTC1695. This is particularly relevant in applications where the LTC1695’s output is loaded with a constant ILOAD and VOUT is dynamically varied via the SMBus. At lower DAC output voltage codes, the increased input-to- output differential increases power dissipation if ILOAD does not decrease. For the LTC1695’s 5-lead SOT-23 surface mount package, heat sinking is accomplished by using the heat spreading capabilities of the PC board and its copper traces (in particular, the GND pin trace). The following table lists measured thermal resistance results for various size boards and copper areas. All measurements were taken in still air on 3/32" FR-4 board with one ounce copper. Table 2. Measured Thermal Resistance ( θθθθθJA) Topside* Backside Board Area 2500mm2 2500mm2 2500mm2 125 °C/W 1000mm2 2500mm2 2500mm2 125 °C/W 225mm2 2500mm2 2500mm2 130 °C/W 100mm2 2500mm2 2500mm2 135 °C/W 50mm2 2500mm2 2500mm2 150 °C/W *Device is mounted on topside + + – + OP AMP + + CGATE CNODE VCC VOUT LFAN CFAN COUT ESR R1 R2 GND EQUIVALENT DC FAN CIRCUIT INTERNAL DAC OUTPUT P1(0.75 Ω) 1695 • F04 Figure 4. Regulator Feedback Loop capacitance ranges from 2pF to 30pF. As previously discussed, an output bypass capacitor is required to stabilize the feedback loop. This output capacitor is in parallel with the fan’s input capacitance and dominates the total capacitance. Thus, stability is generally not affected by the fan’s input capacitance. The output capacitor also serves to filter the fan’s output ripple during commutation of the fan’s motor. POR and UVLO Under start-up conditions, the LTC1695 performs a power on reset (POR) function. The digital logic circuitry is disabled and the regulator is held off. The SMBus com- mand register (to the DAC’s input) and data register (current limit and thermal shutdown status) are reset to zero. The POR signal deactivates if VCC rises above 2.9V typically. The LTC1695 is then allowed to communicate with the SMBus host and drive the fan accordingly. Upon exiting POR, the regulator’s output voltage is set to VZS (code 0) until programmed by the SMBus host. The LTC1695 enters UVLO if VCC falls below 2.8V typically. Between 2.8V and 1V, the digital logic circuitry is disabled, the command/data registers are cleared and the regulator is shut down. In general, 100mV of hysteresis exists between the UVLO and POR thresholds. APPLICATIONS INFORMATION Thermal Resistance (Junction to Ambient) Copper Area |
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