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AN3431 датащи(PDF) 10 Page - STMicroelectronics |
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AN3431 датащи(HTML) 10 Page - STMicroelectronics |
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10 / 18 page ![]() Mechanical construction considerations AN3431 10/18 Doc ID 019017 Rev 1 It can be seen from Table 1 : ● Aluminium has a very favorable ε and σy. Aluminium is also widely available as it is the most abundant metal in the earth's crust. ● The other listed metals can also be used, but the higher force required should be considered. Designing with stringent design parameters can still yield a soft touch on these metals. ● Polycarbonate is a very workable plastic which is used as an electronic component and construction material, in automotive, aircraft and security components, and in niche applications. 2.1.3 Spacer layer The spacer layer is used to create an air-gap between the top cover and the sensor pad on the PCB. When a user presses the top cover (above the sensor pad area), the slight deflection of the overlay material into the air-gap increases the capacitance measured. Although the thickness of the spacer layer is the main design consideration, it is also important to consider the material. A rigid material, such as FR-4 or a nondeformable plastic, should be used for the spacer layer so that it does not deform with the top cover if a force is applied on the overlay material. A rigid spacer layer also keeps the PCB secure. The deflection required in the overlay material should be at least 2-5 %. This yields a 0.9-2 % change in the capacitance of the button (deflection is not linearly equivalent to change in capacitance due to parasitic capacitances). A larger deflection is better because it yields a higher signal-to-noise ratio (SNR). Spacer layer recommendations ● The recommended spacer layer thickness is 0.1-0.5 mm. ● The spacer layer can be a nondeformable plastic film with holes over the buttons. ● The conductive top cover can have blind holes above the sensor pads. This also decreases the cost of spacer layer manufacturing, fitting and adhesion, as it is directly incorporated into top cover. For example, – 0.7 mm Aluminium with 0.2 mm deep blind holes above sensor pads – 1 mm plastic/perspex with 0.2-0.5 mm blind holes above sensor pads ● The holes in the spacer layer are recommended to be at least 110-130 % of the button size. This increases the area which is deflected towards the sensor pad, in essence, increasing the change in capacitance. 2.1.4 PCB layer The PCB layer can be made with an extra mechanical tier over the top routed tier. The PCB can be 0.1-0.5 mm thick with cut-out/blind holes above the sensor pads. This decreases the cost of the spacer layer manufacturing, fitting and adhesion, as it is directly incorporated into the PCB. 2.1.5 Mechanical bracket/support layer This layer can be added to ensure that the module does not bend or move when a force is applied to a button. To get a stable and robust solution, only local deflection over the button is permitted. |
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