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UPD65 датащи(PDF) 55 Page - NEC

номер детали UPD65
подробное описание детали  4-BIT SINGLE-CHIP MICROCONTROLLER FOR INFRARED REMOTE CONTROL TRANSMISSION
PDF  64 Pages
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производитель  NEC [NEC]
домашняя страница  http://www.nec.com/
Logo NEC - NEC

UPD65 датащи(HTML) 55 Page - NEC

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µPD64A, 65
Data Sheet U14380EJ2V0DS00
15. RECOMMENDED SOLDERING CONDITIONS
Carry out the soldered packaging of this product under the following recommended conditions.
For details of the soldering conditions, refer to information material Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than the recommended conditions, please consult one of our NEC
sales representatives.
Table 15-1. Soldering Conditions for Surface-Mount Type
µPD64AMC-×××-5A4 : 20-pin plastic SSOP (300 mil)
µPD65MC-×××-5A4 : 20-pin plastic SSOP (300 mil)
Soldering Method
Soldering Condition
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°C; time: within 30 secs. max. (210 °C or higher);
IR35-00-3
count: no more than three times
VPS
Package peak temperature: 215
°C; time: 40 secs. max. (200 °C or higher); count:
VP15-00-3
no more than three times
Wave soldering
Solder bath temperature: 260
°C max.; time: 10 secs. max.; count: once;
WS60-00-1
Preliminary heat temperature: 120
°C max. (Package surface temperature)
Partial heating
Pin temperature: 300
°C or less ; time: 3 secs or less (for each side of the device)
—
Caution Using more than one soldering method should be avoided (except in the case of partial heating).



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