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AN4406 датащи(PDF) 9 Page - STMicroelectronics

номер детали AN4406
подробное описание детали  new ST super-junction technology ideal for resonant topologies
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AN4406
Impact of the MOSFET parasitic capacitances
27
So, for the time TT for voltage VHB to reach Vin, TT can be expressed as:
Equation 4
Note:
In order to guarantee the ZVS transitions, the value of TT must not exceed the dead time TD
to ensure that the switch is turned on with zero VDS voltage.
From the previous equation, it is possible to note that converter operation may be influenced
by the parasitic capacitances of the MOSFET, so MOSFET's switching behavior can be
affected by the parasitic capacitances between the three terminals of the device: gate-to-
source (CGS), gate-to-drain (CGD) and drain-to-source (CDS) capacitances.
These capacitance values are non-linear and a function of device structure, geometry, and
bias voltages VDS. The magnitudes are largely determined by the size of the chip and cell
topology used. Manufacturers do not generally specify CGD, CGS and CDS directly, but the
magnitudes and the profile of the parasitic capacitances are given in datasheets by the
voltage VDS and also by the technology of the MOSFET.
In Figure 5, the Coss parasitic capacitances of two MOSFETs with the same die size but with
different technologies are shown.
Figure 5. Output capacitances of two devices with same die size but different
technologies
The technology with the larger density cell (MDmesh™ M5) clearly has a higher COSS
parasitic capacitance value at low VDS voltages. This aspect is not only due to the cellular
density, but also the different doping process used to obtain the same VDSS. In fact, the two
analyzed devices have same die size, same BVDSS, but different RDS(on) owing to the
different technologies adopted.
The theory introduced earlier helps explain the impact of MOSFET parasitic capacitances
when it used on resonant topologies.
HB
R
in
T
C
)
0
(
I
)
t
(
V
=
T



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