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AN4068 датащи(PDF) 45 Page - STMicroelectronics

номер детали AN4068
подробное описание детали  ST7580 power line communication system-on-chip design guide
PDF  63 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

AN4068 датащи(HTML) 45 Page - STMicroelectronics

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AN4068
Design guidelines
Doc ID 022923 Rev 2
45/63
Equation 10
where TA is the ambient temperature (from -40 to +85 °C) and ZthJA is the junction to
ambient thermal impedance of the ST7580 IC, which is related to the length of the
transmission (tTX) and to the duty cycle d = tPKT / (tPKT + tIDLE), assuming a packet-
fragmented transmission as illustrated by Figure 36.
Figure 36.
Packet-fragmented transmission
When soldered to a proper dissipating area on the PCB as explained above, the ST7580 IC
is characterized by a steady-state thermal resistance RthJA of about 50 °C/W. The thermal
impedance curve obtained as the power dissipation step response is given in Figure 37.
Figure 37.
Measured ST7580 thermal impedance curve (typical)
It can be seen that the transient of ZthJA takes some thousand seconds, after which the
static value of 50 °C/W is reached. This means that during the transient phase (i.e. if the
transmission time tTX is some seconds or even less) the IC is able to dissipate a power that
is far higher than the one sustainable at steady-state.
)
d
,
t
(
Zth
P
T
)
d
,
t
(
T
TX
JA
D
A
TX
J
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