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80C188EB13 датащи(PDF) 23 Page - Intel Corporation |
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80C188EB13 датащи(HTML) 23 Page - Intel Corporation |
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23 / 59 page ![]() 80C186EB80C188EB 80L186EB80L188EB ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings Storage Temperature b 65 Cto a150 C Case Temp under Bias b 65 Cto a120 C Supply Voltage with Respect to VSS b 05V to a 65V Voltage on other Pins with Respect to VSS b 05V to VCC a 05V NOTICE This data sheet contains preliminary infor- mation on new products in production It is valid for the devices indicated in the revision history The specifications are subject to change without notice WARNING Stressing the device beyond the ‘‘Absolute Maximum Ratings’’ may cause permanent damage These are stress ratings only Operation beyond the ‘‘Operating Conditions’’ is not recommended and ex- tended exposure beyond the ‘‘Operating Conditions’’ may affect device reliability Recommended Connections Power and ground connections must be made to multiple VCC and VSS pins Every 80C186EB-based circuit board should include separate power (VCC) and ground (VSS) planes Every VCC pin must be connected to the power plane and every VSS pin must be connected to the ground plane Pins identi- fied as ‘‘NC’’ must not be connected in the system Liberal decoupling capacitance should be placed near the processor The processor can cause tran- sient power surges when its output buffers tran- sition particularly when connected to large capaci- tive loads Low inductance capacitors and interconnects are recommended for best high frequency electrical per- formance Inductance is reduced by placing the de- coupling capacitors as close as possible to the proc- essor VCC and VSS package pins Always connect any unused input to an appropriate signal level In particular unused interrupt inputs (INT04) should be connected to VCC through a pull- up resistor (in the range of 50 KX) Leave any un- used output pin or any NC pin unconnected 23 23 |
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