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80960CF-33 датащи(PDF) 27 Page - Intel Corporation

номер детали 80960CF-33
подробное описание детали  80960CF-40, -33, -25, -16 32-BIT HIGH-PERFORMANCE SUPERSCALAR EMBEDDED MICROPROCESSOR
PDF  77 Pages
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производитель  INTEL [Intel Corporation]
домашняя страница  http://www.intel.com
Logo INTEL - Intel Corporation

80960CF-33 датащи(HTML) 27 Page - Intel Corporation

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PRELIMINARY
21
A
80960CF-40, -33, -25, -16
Table 10. 80960CF PGA Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
Airflow — ft./min (m/sec)
0
(0)
200
(1.01)
400
(2.03)
600
(3.07)
800
(4.06)
1000
(5.07)
θ Junction-to-Case
(Case measured as
shown in Figure 5)
1.5
1.5
1.5
1.5
1.5
1.5
θ Case-to-Ambient
(No Heatsink)
17
14
11
9
7.1
6.6
θ Case-to-Ambient
(With Heatsink)*
13
9
5.5
5
3.9
3.4
NOTES:
1. This table applies to 80960CF PGA plugged into socket or soldered directly to board.
2.
θ
JA = θJC + θCA
*0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).
Table 11. 80960CF PQFP Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
Airflow — ft./min (m/sec)
0
(0)
50
(0.25)
100
(0.50)
200
(1.01)
400
(2.03)
600
(3.04)
800
(4.06)
θ Junction-to-Case (Case Measured
as shown in Figure 5)
5
5
555
55
θ Case-to-Ambient (No Heatsink)
19
18
17
15
12
10
9
NOTES:
1. This table applies to 80960CF PQFP soldered directly to board.
2.
θ
JA = θJC + θCA
θ
JC
θ
JA
θ
JC



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