AD5231 datasheet(7/28 Pages) AD

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Data Sheet

AD5231

Rev. D | Page 7 of 28

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 3.

Parameters

Ratings

VDD to GND

–0.3 V, +7 V

VSS to GND

+0.3 V, −7 V

VDD to VSS

7 V

VA, VB, VW to GND

VSS − 0.3 V, VDD + 0.3 V

A–B, A–W, B–W

Intermittent1

±20 mA

Continuous

±2 mA

Digital Input and Output Voltage

to GND

−0.3 V, VDD + 0.3 V

Operating Temperature Range2

−40°C to +85°C

Maximum Junction Temperature

(TJ max)

150°C

Storage Temperature

−65°C to +150°C

Reflow Soldering

Peak Temperature

260°C

Time at Peak Temperature

20 sec to 40 sec

Thermal Resistance

Junction-to-Ambient (θJA),TSSOP-16

150°C/W

Junction-to-Case (θJC), TSSOP-16

28°C/W

Package Power Dissipation

(TJ max − TA)/θJA

Maximum terminal current is bounded by the maximum current handling of the

switches, maximum power dissipation of the package, and maximum applied

voltage across any two of the A, B, and W terminals at a given resistance.

Includes programming of nonvolatile memory.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION

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