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ICS673M-01 датащи(PDF) 9 Page - Integrated Circuit Systems

номер детали ICS673M-01
подробное описание детали  PLL Building Block
PDF  9 Pages
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производитель  ICST [Integrated Circuit Systems]
домашняя страница  http://www.icst.com
Logo ICST - Integrated Circuit Systems

ICS673M-01 датащи(HTML) 9 Page - Integrated Circuit Systems

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ICS673-01
PLL Building Block
MDS 673-01 D
9
Revision 022500
Printed 11/15/00
Integrated Circuit Systems, Inc. • 525 Race Street • San Jose • CA • 95126•(408)295-9800tel • www.icst.com
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorpor ated (ICS) assumes no responsibility for either its
use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is
intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary
environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does
not authorize or warrant any ICS product for use in life support devices or critical medical instruments.
Ordering Information
Part/Order Number
Marking
Shipping packaging
Package
Temperature
ICS673M-01
ICS673M-01
tubes
16 pin SOIC
0 to 70 °C
ICS673M-01T
ICS673M-01
tape and reel
16 pin SOIC
0 to 70 °C
ICS673M-01I
ICS673M-01I
tubes
16 pin SOIC
-40 to 85 °C
ICS673M-01IT
ICS673M-01I
tape and reel
16 pin SOIC
-40 to 85 °C
16 pin SOIC narrow
Inch
hes
Millim
meters
Symbol
Min
Max
Min
Max
A
0.0532
0.0688
1.35
1.75
A1
0.0040
0.0098
0.10
0.24
B
0.0130
0.0200
0.33
0.51
C
0.0075
0.0098
0.19
0.24
D
0.3859
0.3937
9.80
10.00
E
0.1497
0.1574
3.80
4.00
e
.050 BSSC
1.27 BSSC
H
0.2284
0.2440
5.80
6.20
h
0.0099
0.0195
0.25
0.50
L
0.0160
0.0500
0.41
1.27
B
D
EH
e
A1
C
A
h x 45°
L
INDEX
AREA
12
Package Outline and Package Dimensions
(For current dimensional specifications, see JEDEC Publication No. 95.)



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