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VND830ASP-E датащи(PDF) 17 Page - STMicroelectronics

номер детали VND830ASP-E
подробное описание детали  Double channel high-side solid state relay
PDF  27 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

VND830ASP-E датащи(HTML) 17 Page - STMicroelectronics

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VND830ASP-E
Application information
Doc ID 17605 Rev 2
17/27
3
Application information
Figure 19. Application schematic
3.1
GND protection network against reverse battery
3.1.1
Solution 1: resistor in the ground line (RGND only)
This can be used with any type of load.
The following is an indication on how to dimension the RGND resistor.
1.
RGND ≤ 600 mV / IS(on)max
2.
RGND ≥ (-VCC) / (-IGND)
where -IGND is the DC reverse ground pin current and can be found in the absolute
maximum rating section of the device’s datasheet.
Power dissipation in RGND (when VCC < 0: during reverse battery situations) is:
PD= (-VCC)
2/ R
GND
This resistor can be shared amongst several different HSDs. Please note that the value of
this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the
maximum on-state currents of the different devices.
Please note that if the microprocessor ground is not shared by the device ground then the
RGND produces a shift (IS(on)max * RGND) in the input thresholds and the status output
values. This shift varies depending on how many devices are ON in the case of several
high-side drivers sharing the same RGND.
If the calculated power dissipation leads to a large resistor or several devices have to share
the same resistor then ST suggests to utilize solution 2 (see Section 3.1.2).
VCC
GND
OUTPUT2
CURRENT SENSE1
Dld
+5V
Rprot
RSENSE2
OUTPUT1
RSENSE1
INPUT1
DGND
RGND
VGND
CURRENT SENSE2
INPUT2
μC
Rprot
Rprot
Rprot



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