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LP3907 датащи(PDF) 6 Page - Texas Instruments |
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LP3907 датащи(HTML) 6 Page - Texas Instruments |
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6 / 57 page ![]() LP3907 SNVS511N – JUNE 2007 – REVISED AUGUST 2011 www.ti.com Table 2. Pin Descriptions (continued) LLP Pin micro SMD Name I/O Type Description No. pin no. 16 C2 SDA I/O D I2C Data (bidirectional) 17 B2 SCL I D I2C Clock 18 B1 GND_L G G LDO ground 19 A1 VINLDO1 I PWR Power in from either DC source or battery to input terminal to LDO1 20 A2 LDO1 O PWR LDO1 Output 21 B3 ENLDO1 I D LDO1 enable pin, a logic HIGH enables the LDO1 22 A3 ENLDO2 I D LDO2 enable pin, a logic HIGH enables the LDO2 23 A4 LDO2 O PWR LDO2 Output 24 A5 VINLDO2 I PWR Power in from either DC source or battery to input terminal to LDO2. DAP DAP GND GND Connection isn't necessary for electrical performance, but it is recommended for better thermal dissipation. Power Block Operation Note Power Block Input Enabled Disabled VINLDO12 VIN+ VIN+ Always Powered AVDD VIN+ VIN+ Always Powered VIN1 VIN+ VIN+ or 0V VIN2 VIN+ VIN+ or 0V LDO 1 ≤ VIN+ ≤ VIN+ If Enabled, Min Vin is 1.74V LDO 2 ≤ VIN+ ≤ VIN+ If Enabled, Min Vin is 1.74V VIN+ is the largest potential voltage on the device. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) VIN, SDA, SCL −0.3V to +6V GND to GND SLUG ±0.3V Power Dissipation (PD_MAX) (TA=85°C, TMAX=125°C, ) (3) 1.43W Junction Temperature (TJ-MAX) 150°C Storage Temperature Range −65°C to +150°C Maximum Lead Temperature (Soldering) 260°C ESD Ratings Human Body Model (4) 2kV (1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics. (2) All voltages are with respect to the potential at the GND pin. (3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the part/package in the application ( θJA), as given by the following equation: TA-MAX = TJ-MAX-OP − (θJA × PD-MAX). See Applications section. (4) The Human body model is a 100pF capacitor discharged through a 1.5k Ω resistor into each pin. (MILSTD - 883 3015.7) 6 Submit Documentation Feedback Copyright © 2007–2011, Texas Instruments Incorporated Product Folder Links: LP3907 |
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