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LP3907 датащи(PDF) 4 Page - Texas Instruments |
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LP3907 датащи(HTML) 4 Page - Texas Instruments |
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4 / 57 page ![]() A B C D E SW1 VIN LDO12 GND_C SCL 5 4 3 2 1 VIN1 VIN LDO2 LDO2 AVDD FB2 LDO1 GND_S W1 FB1 EN_S W1 EN_T VIN LDO12 nPOR EN_ LDO1 SDA VIN2 SW2 GND_ SW2 VIN LDO1 EN_ LDO2 EN_ SW2 GND_ L 1 2 3 4 5 6 7 14 13 12 11 10 9 8 LP3907 SNVS511N – JUNE 2007 – REVISED AUGUST 2011 www.ti.com Connection Diagrams and Package Mark Information Figure 3. 24-Lead LLP Package (top view NOTE The physical placement of the package marking will vary from part to part. (*) UZXYTT format: ‘U’ – wafer fab code; ‘Z’ – assembly code; ’XY’ 2 digit date code; ‘TT” – die run code. See http://www.national.com/quality/marking_conventions.html for more information on marking information. (**) Package received will have XXXX replaced with the specific part version ordered. 25-Bump Thin Micro SMD Package, Large Bump National Package Number TLA25AAA Figure 4. Top View 4 Submit Documentation Feedback Copyright © 2007–2011, Texas Instruments Incorporated Product Folder Links: LP3907 |
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