STM32L152C6 datasheet(127/131 Pages) STMICROELECTRONICS

127 / 131 page

DocID17659 Rev 9

127/131

STM32L151x6/8/B, STM32L152x6/8/B

Revision history

130

17-June-2011

Modified 1st page (low power features)

Added STM32L15xC6 and STM32L15xR6 devices (32 Kbytes of

Flash memory).

Modified Section 3.6: GPIOs (general-purpose inputs/outputs) on

page 22

Modified Section 6.3: Operating conditions on page 52

Modified Table 55: ADC accuracy on page 96, Table 57: DAC

characteristics on page 100 and Table 60: Comparator 1

characteristics on page 103

25-Jan-2012

Features: updated internal multispeed low power RC.

Table 2: Ultralow power STM32L15xxx device features and

peripheral counts: LCD 4x44 and 8x40 available for both 64- and

128-Kbyte devices; two comparators available for all devices.

Table 3: Functionalities depending on the operating power supply

range: added footnote 1.

Figure 8: STM32L15xCx UFQFPN48 pinout: replaced VFQPN48 by

UFQFPN48 as name of package.

Table 8: STM32L15xxx pin definitions: replaced PH0/PH1 by

PC14/PC15.

Table 9: Alternate function input/output: removed EVENT OUT from

PH2 port, AFIO15 column.

Table 19: Current consumption in Sleep mode: updated MSI

conditions and fHCLK.

Table 20: Current consumption in Low power run mode: updated

some temperature conditions; added footnote 2.

Table 21: Current consumption in Low power sleep mode: updated

some temperature conditions and one of the MSI clock conditions.

Table 22: Typical and maximum current consumptions in Stop

mode: updated IDD (WU from Stop) parameter.

Table 23: Typical and maximum current consumptions in Standby

mode: updated IDD (WU from Standby) parameter.

Table 25: Low-power mode wakeup timings: updated fHCLK value

for tWUSLEEP_LP; updated typical value of parameter “Wakeup from

Stop mode, regulator in Run mode”.

Table 24: Peripheral current consumption: replaced GPIOF by

GPIOH.

Table 33: PLL characteristics: updated “PLL output clock”

Table 35: Flash memory and data EEPROM characteristics:

updated all information for IDD.

Figure 19: I/O AC characteristics definition: replaced the falling

edge “tr(IO)out” by “tf(IO)out”.

Table 47: I2C characteristics: amended footnote 2.

Table 54: ADC characteristics: updated fS max value for direct

channels, 6-bit sampling rate.

Table 55: ADC accuracy: Updated the first, third and fourth fADC test

condition.

Table 59: Temperature sensor characteristics: updated typ, min,

and max values of the TS_temp parameter.

Table 71. Document revision history (continued)

Date

Revision

Changes

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