PACKAGE OPTION ADDENDUM

www.ti.com

1-Nov-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C)

Device Marking

(4/5)

Samples

LM7372IMA

NRND

SOIC

D

16

48

TBD

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Call TI

-40 to 85

LM7372IMA

LM7372IMA/NOPB

ACTIVE

SOIC

D

16

48

Green (RoHS

& no Sb/Br)

CU SN

Level-1-260C-UNLIM

-40 to 85

LM7372IMA

LM7372IMAX/NOPB

ACTIVE

SOIC

D

16

2500

Green (RoHS

& no Sb/Br)

CU SN

Level-1-260C-UNLIM

-40 to 85

LM7372IMA

LM7372MR

NRND

SO PowerPAD

DDA

8

95

TBD

Call TI

Call TI

-40 to 85

LM73

72MR

LM7372MR/NOPB

ACTIVE

SO PowerPAD

DDA

8

95

Green (RoHS

& no Sb/Br)

SN | CU SN

Level-3-260C-168 HR

-40 to 85

LM73

72MR

LM7372MRX

NRND

SO PowerPAD

DDA

8

2500

TBD

Call TI

Call TI

-40 to 85

LM73

72MR

LM7372MRX/NOPB

ACTIVE

SO PowerPAD

DDA

8

2500

Green (RoHS

& no Sb/Br)

SN | CU SN

Level-3-260C-168 HR

-40 to 85

LM73

72MR

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)