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LM7372IMA датащи(PDF) 17 Page - National Semiconductor (TI) |
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LM7372IMA датащи(HTML) 17 Page - National Semiconductor (TI) |
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17 / 26 page ![]() LM7372 www.ti.com SNOS926E – MAY 1999 – REVISED MARCH 2013 PD(TOTAL) = PQ + PDC + PAC PQ = |IS • VS| Op Amp Quiescent Power Dissipation PDC = |IO • (VR - VO)| DC Load Power PAC = See Table 3 AC Load Power where: IS Supply Current VS Total Supply Voltage (V+ - V−) IO Average Load Current VO Average Output Voltage VR Reference Voltage (V+ for sourcing and V− for sinking current) Table 3 below shows the maximum AC component of the load power dissipated by the op amp for standard Sinusoidal, Triangular, and Square Waveforms: Table 3. Normalized maximum AC Power Dissipated in the Output Stage for Standard Waveforms PAC (W.Ω/V 2) Sinusoidal Triangular Square 50.7 x 10−3 46.9 x 10−3 62.5 x 10−3 The table entries are normalized to VS 2/R L. These entries are computed at the output swing point where the amplifier dissipation is the highest for each waveform type. To figure out the AC load current component of power dissipation, simply multiply the table entry corresponding to the output waveform by the factor VS 2/R L. For example, with ±5V supplies, a 100 Ω load and triangular output waveform, power dissipation in the output stage is calculated as: PAC = 46.9 x 10 −3 x 102/100 = 46.9mW which contributes another 2.2°C (= 46.9mW x 47°C/W) rise to the LM7372 junction temperature in the 8-Pin SO PowerPAD package. POWER SUPPLIES The LM7372 is fabricated on a high voltage, high speed process. Using high supply voltages ensures adequate headroom to give low distortion with large signal swings. In Figure 1, a single 24V supply is used. To maximize the output dynamic range the non-inverting inputs are biased to half supply voltage by the resistive divider R1, R2. The input signals are AC coupled and the coupling capacitors (C1, C2) can be scaled with the bias resistors (R3, R4) to form a high pass filter if unwanted coupling from the POTS signal occurs. Supply decoupling is important at both low and high frequencies. The 10µF Tantalum and 0.1µF Ceramic capacitors should be connected close to the supply Pin 14. Note that the V− pin (pin 6), and the PCB area associated with the heatsink (Pins 1,8,9 & 16) are at the same potential. Any layout should avoid running input signal leads close to this ground plane, or unwanted coupling of high frequency supply currents may generate distortion products. Although this application shows a single supply, conversion to a split supply is straightforward. The half supply resistive divider network is eliminated and the bias resistors at the non-inverting inputs are returned to ground, see Figure 28 (the pin numbers in Figure 28 are given for SO PowerPAD package, those in Figure 1 are for the SOIC package). With a split supply, note that the ground plane and the heatsink copper must be separate and are at different potentials, with the heatsink (pin 4 of the SO PowerPAD, pins 6,1,8,9 &16 of the SOIC) now at a negative potential (V−). In either configuration, the area under the input pins should be kept clear of copper (whether ground plane copper or heatsink copper) to avoid parasitic coupling to the inputs. The LM7372 is stable with non inverting closed loop gains as low as +2. Typical of any voltage feedback operational amplifier, as the closed loop gain of the LM7372 is increased, there is a corresponding reduction in the closed loop signal bandwidth. For low distortion performance it is recommended to keep the closed loop bandwidth at least 10X the highest signal frequency. This is because there is less loop gain (the difference between the open loop gain and the closed loop gain) available at higher frequencies to reduce harmonic distortion terms. Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 17 Product Folder Links: LM7372 |
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