FG256 datasheet(2/108 Pages) ACTEL

2 / 108 page

SX-A Family FPGAs

v5.3

Ordering Information

Device Resources

Notes:

1. For more information about the CQFP package options, refer to the HiRel SX-A datasheet.

2. All –3 speed grades have been discontinued.

Package Lead Count

A54SX16A

208

Part Number

A54SX08A = 12,000 System Gates

A54SX16A = 24,000 System Gates

A54SX32A = 48,000 System Gates

A54SX72A = 108,000 System Gates

Speed Grade

Blank = Standard Speed

–1 = Approximately 15% Faster than Standard

–2 = Approximately 25% Faster than Standard

–3 = Approximately 35% Faster than Standard

–F = Approximately 40% Slower than Standard

Package Type

BG = 1.27 mm Plastic Ball Grid Array

FG = 1.0 mm Fine Pitch Ball Grid Array

PQ = Plastic Quad Flat Pack

TQ = Thin (1.4 mm) Quad Flat Pack

CQ = Ceramic Quad Flat Pack

Application (Temperature Range)

Blank = Commercial (0 to +70°)

= Industrial (-40 to +85°C)

= Automotive (-40 to +125°C)

M = Military (-55 to +125°C)

= MIL-STD-883 Class B

Lead-Free Packaging

Blank = Standard Packaging

G = RoHS Compliant Packaging

User I/Os (Including Clock Buffers)

Device

208-Pin

PQFP

100-Pin

TQFP

144-Pin

TQFP

176-Pin

TQFP

329-Pin

PBGA

144-Pin

FBGA

256-Pin

FBGA

484-Pin

FBGA

A54SX08A

130

113

–

111

–

A54SX16A

175

113

–

111

180

–

A54SX32A

174

113

147

249

111

203

249

A54SX72A

171

–

203

360

Notes: Package Definitions: PQFP = Plastic Quad Flat Pack, TQFP = Thin Quad Flat Pack, PBGA = Plastic Ball Grid Array,

FBGA = Fine Pitch Ball Grid Array

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