MPC5601PEF0MLL4R datasheet(41/95 Pages) FREESCALE

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MPC5602P Microcontroller Data Sheet, Rev. 4.1

Freescale Semiconductor

where:

RJA = junction-to-ambient thermal resistance (°C/W)

RJC = junction-to-case thermal resistance (°C/W)

RCA = case-to-ambient thermal resistance (°C/W)

RJC is device related and cannot be influenced by the user. The user controls the thermal environment to change the

case-to-ambient thermal resistance, RCA. For instance, the user can change the size of the heat sink, the air flow around the

device, the interface material, the mounting arrangement on printed circuit board, or change the thermal dissipation on the

printed circuit board surrounding the device.

To determine the junction temperature of the device in the application when heat sinks are not used, the Thermal

Characterization Parameter (

JT) can be used to determine the junction temperature with a measurement of the temperature at

the top center of the package case using Equation 3:

TJ = TT + (JT x PD)

Eqn. 3

where:

TT = thermocouple temperature on top of the package (°C)

JT = thermal characterization parameter (°C/W)

PD = power dissipation in the package (W)

The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T thermocouple epoxied

to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the

package. A small amount of epoxy is placed over the thermocouple junction and over about 1 mm of wire extending from the

junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects

of the thermocouple wire.

References:

•

Semiconductor Equipment and Materials International

3081 Zanker Road

San Jose, CA 95134U.S.A.

(408) 943-6900

•

MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at (800)

854-7179 or (303) 397-7956.

•

JEDEC specifications are available on the WEB at http://www.jedec.org.

•

C.E. Triplett and B. Joiner, An Experimental Characterization of a 272 PBGA Within an Automotive Engine Controller

Module, Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.

•

G. Kromann, S. Shidore, and S. Addison, Thermal Modeling of a PBGA for Air-Cooled Applications, Electronic

Packaging and Production, pp. 53–58, March 1998.

•

B. Joiner and V. Adams, Measurement and Simulation of Junction to Board Thermal Resistance and Its Application in

Thermal Modeling, Proceedings of SemiTherm, San Diego, 1999, pp. 212–220.

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