DSPIC33FJ64GP706 datasheet(259/322 Pages) MICROCHIP

259 / 322 page

DS70286C-page 257

dsPIC33FJXXXGPX06/X08/X10

25.0 ELECTRICAL CHARACTERISTICS

This section provides an overview of dsPIC33FJXXXGPX06/X08/X10 electrical characteristics. Additional information

will be provided in future revisions of this document as it becomes available.

Absolute maximum ratings for the dsPIC33FJXXXGPX06/X08/X10 family are listed below. Exposure to these maximum

rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any

other conditions above the parameters indicated in the operation listings of this specification is not implied.

Absolute Maximum Ratings(1)

Ambient temperature under bias...............................................................................................................-40°C to +85°C

Storage temperature .............................................................................................................................. -65°C to +150°C

Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V

Voltage on any combined analog and digital pin and MCLR, with respect to VSS ......................... -0.3V to (VDD + 0.3V)

Voltage on any digital-only pin with respect to VSS .................................................................................. -0.3V to +5.6V

Voltage on VCAP/VDDCORE with respect to VSS ....................................................................................... 2.25V to 2.75V

Maximum current out of VSS pin ...........................................................................................................................300 mA

Maximum current into VDD pin(2)...........................................................................................................................250 mA

Maximum output current sunk by any I/O pin(3) ........................................................................................................4 mA

Maximum output current sourced by any I/O pin(3)...................................................................................................4 mA

Maximum current sunk by all ports .......................................................................................................................200 mA

Maximum current sourced by all ports(2)...............................................................................................................200 mA

Note 1: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions

above those indicated in the operation listings of this specification is not implied. Exposure to maximum

rating conditions for extended periods may affect device reliability.

2: Maximum allowable current is a function of device maximum power dissipation (see Table 25-2).

3: Exceptions are CLKOUT, which is able to sink/source 25 mA, and the VREF+, VREF-, SCLx, SDAx, PGECx

and PGEDx pins, which are able to sink/source 12 mA.

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