BAP70AM

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Product data sheet

Rev. 2 — 7 September 2010

4 of 8

NXP Semiconductors

BAP70AM

Silicon PIN diode array

8.

Package outline

Fig 3.

Package outline SOT363

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

SOT363

SC-88

wB

M

bp

D

e1

e

pin 1

index

A

A1

Lp

Q

detail X

HE

E

A

B

y

0

1

2 mm

scale

c

X

13

2

4

5

6

Plastic surface-mounted package; 6 leads

SOT363

UNIT

A1

max

bp

cD

E

HE

Lp

Qy

w

v

mm

0.1

0.30

0.20

2.2

1.8

0.25

0.10

1.35

1.15

0.65

e

1.3

2.2

2.0

0.2

0.1

0.2

DIMENSIONS (mm are the original dimensions)

0.45

0.15

0.25

0.15

A

1.1

0.8

04-11-08

06-03-16