LM628, LM629

SNVS781C – JUNE 1999 – REVISED MARCH 2013

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Connection Diagrams

LM628N

LM629N

LM629M

*Do not connect.

Figure 2. See Package Number DW or N

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

Voltage at Any Pin with

Respect to GND

−0.3V to +7.0V

Ambient Storage Temperature

−65°C to +150°C

28-pin PDIP Package (Soldering, 4 sec.)

260°C

Lead Temperature

24-pin SOIC Package (Soldering, 10 sec.)

300°C

(3)

605 mW

ESD Tolerance

1000V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not

apply when operating the device beyond the above Operating Ratings.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

When operating at ambient temperatures above 70°C, the device must be protected against excessive junction temperatures. Mounting

the package on a printed circuit board having an area greater than three square inches and surrounding the leads and body with wide

copper traces and large, uninterrupted areas of copper, such as a ground plane, suffices. The 28-pin DIP (N) and the 24-pin surface

mount package (M) are molded plastic packages with solid copper lead frames. Most of the heat generated at the die flows from the die,

through the copper lead frame, and into copper traces on the printed circuit board. The copper traces act as a heat sink. Double-sided

or multi-layer boards provide heat transfer characteristics superior to those of single-sided boards.

Operating Ratings

Temperature Range

LM628N-6, LM629N-6, LM629M-6

Clock Frequency

LM628N-8, LM629N-8, LM629M-8

2

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