CBTL04DP211

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© NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 2 — 13 April 2012

5 of 18

NXP Semiconductors

CBTL04DP211

DisplayPort 2 : 1 multiplexer

[1]

HVQFN32 package die supply ground is connected to both GND pins and exposed center pad. GND pins

and the exposed center pad must be connected to supply ground for proper device operation. For

enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to the

board using a corresponding thermal pad on the board and for proper heat conduction through the board,

thermal vias need to be incorporated in the printed-circuit board in the thermal pad region.

OUT_0+

1

differential I/O

Two bidirectional high-speed differential pairs for

DisplayPort Main Link signals.

OUT_0

−

2

differential I/O

OUT_1+

4

differential I/O

OUT_1

−

5

differential I/O

AUX1+

19

differential I/O

High-speed differential pair for AUX signals,

path 1.

AUX1

−

18

differential I/O

AUX2+

15

differential I/O

High-speed differential pair for AUX signals,

path 2.

AUX2

−

14

differential I/O

AUX+

6

differential I/O

High-speed differential pair for AUX signals.

AUX

−

7

differential I/O

HPD_1

17

single-ended I/O

Single-ended channel for the HPD signal, path 1.

HPD_2

13

single-ended I/O

Single-ended channel for the HPD signal, path 2.

HPD_IN

8

single-ended I/O

Single-ended channel for the HPD signal.

3, 9, 12, 16,

20, 29

power supply

3.3 V power supply.

GND[1]

21, 28,

center pad

ground

Ground.

n.c.

11

-

Not connected. This pin is not connected to any

signal internally.

Table 2.

Symbol

Pin

Type

Description