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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STM8S103F2 датащи(PDF) 96 Page - STMicroelectronics |
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STM8S103F2 датащи(HTML) 96 Page - STMicroelectronics |
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96 / 117 page  32-lead UFQFPN package mechanical data 11.2 Figure 46: 32-lead, ultra thin, fine pitch quad flat no-lead package (5 x 5) AOB8_ME 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this backside pad to PCB ground. 4. Dimensions are in millimeters. Table 53: 32-lead, ultra thin, fine pitch quad flat no-lead package mechanical data inches (1) mm Dim. Max Typ Min Max Typ Min 0.0236 0.0217 0.0197 0.600 0.550 0.500 A 0.0020 0.0008 0.050 0.020 0 A1 0.0079 0.200 A3 DocID15441 Rev 9 96/117 STM8S103K3 STM8S103F3 STM8S103F2 Package information |
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