| поискавой системы для электроныых деталей |
|
LTC6085CDHC датащи(PDF) 15 Page - Linear Integrated Systems |
|
|
|||||||||||||||||||||||||||||
LTC6085CDHC датащи(HTML) 15 Page - Linear Integrated Systems |
|
15 / 16 page ![]() LTC6084/LTC6085 15 60845fa Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. PACKAGE DESCRIPTION MS8 Package 8-Lead Plastic MSOP (Reference LTC DWG # 05-08-1660) MSOP (MS8) 0307 REV F 0.53 ± 0.152 (.021 ± .006) SEATING PLANE NOTE: 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 0.18 (.007) 0.254 (.010) 1.10 (.043) MAX 0.22 – 0.38 (.009 – .015) TYP 0.1016 ± 0.0508 (.004 ± .002) 0.86 (.034) REF 0.65 (.0256) BSC 0 ° – 6° TYP DETAIL “A” DETAIL “A” GAUGE PLANE 12 3 4 4.90 ± 0.152 (.193 ± .006) 8 7 6 5 3.00 ± 0.102 (.118 ± .004) (NOTE 3) 3.00 ± 0.102 (.118 ± .004) (NOTE 4) 0.52 (.0205) REF 5.23 (.206) MIN 3.20 – 3.45 (.126 – .136) 0.889 ± 0.127 (.035 ± .005) RECOMMENDED SOLDER PAD LAYOUT 0.42 ± 0.038 (.0165 ± .0015) TYP 0.65 (.0256) BSC GN Package 16-Lead Plastic SSOP (Narrow .150 Inch) (Reference LTC DWG # 05-08-1641) GN16 (SSOP) 0204 12 3 4 5 6 7 8 .229 – .244 (5.817 – 6.198) .150 – .157** (3.810 – 3.988) 16 15 14 13 .189 – .196* (4.801 – 4.978) 12 11 10 9 .016 – .050 (0.406 – 1.270) .015 ± .004 (0.38 ± 0.10) × 45° 0 ° – 8° TYP .007 – .0098 (0.178 – 0.249) .0532 – .0688 (1.35 – 1.75) .008 – .012 (0.203 – 0.305) TYP .004 – .0098 (0.102 – 0.249) .0250 (0.635) BSC .009 (0.229) REF .254 MIN RECOMMENDED SOLDER PAD LAYOUT .150 – .165 .0250 BSC .0165 ±.0015 .045 ±.005 *DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE **DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE INCHES (MILLIMETERS) NOTE: 1. CONTROLLING DIMENSION: INCHES 2. DIMENSIONS ARE IN 3. DRAWING NOT TO SCALE |
|
|
ссылки URL |
| Вашему бизинису помогли Аллдатащит? [ DONATE ] |
Что такое Аллдатащит | реклама | контакт | Конфиденциальность | Ссылка на техническое описание | обмен ссыками | поиск по производителю All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |