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MP1583DN датащи(PDF) 9 Page - Monolithic Power Systems |
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MP1583DN датащи(HTML) 9 Page - Monolithic Power Systems |
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9 / 13 page ![]() MP1583 – 3A, 23V, 385KHz STEP-DOWN CONVERTER MP1583 Rev. 3.1 www.MonolithicPower.com 9 6/20/2011 MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited. © 2011 MPS. All Rights Reserved. To optimize the compensation components for conditions not listed in Table 2, the following procedure can be used. 1. Choose the compensation resistor (R3) to set the desired crossover frequency. Determine R3 by the following equation: FB OUT CS EA C V V G G f 2 C 2 3 R × × × × π = Where fC is the desired crossover frequency (which typically has a value no higher than 38KHz). 2. Choose the compensation capacitor (C3) to achieve the desired phase margin. For applications with typical inductor values, setting the compensation zero, fZ1, below one forth of the crossover frequency provides sufficient phase margin. Determine C3 by the following equation: C f 3 R 2 4 3 C × × π > Where R3 is the compensation resistor value. 3. Determine if the second compensation capacitor (C6) is required. It is required if the ESR zero of the output capacitor is located at less than half of the 385KHz switching frequency, or if the following relationship is valid: 2 f R 2 C 2 1 S ESR < × × π If this is the case, then add the second compensation capacitor (C6) to set the pole fP3 at the location of the ESR zero. Determine C6 by the equation: 3 R R 2 C 6 C ESR × = PCB Layout Guide PCB layout is very important to achieve stable operation. Please follow these guidelines and take Figure2 and 3 for references. 1) Keep the path of switching current short and minimize the loop area formed by Input cap, high-side and low-side MOSFETs. 2) Keep the connection of low-side MOSFET between SW pin and input power ground as short and wide as possible. 3) Ensure all feedback connections are short and direct. Place the feedback resistors and compensation components as close to the chip as possible. 4) Route SW away from sensitive analog areas such as FB. 5) Connect IN, SW, and especially GND respectively to a large copper area to cool the chip to improve thermal performance and long-term reliability. For single layer, do not solder exposed pad of the IC C1 D1 R1 C2 R4 SGND PGND L1 C3 C6 R2 R3 SGND Figure 2―PCB Layout (Single Layer) |
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