Copyright

© ANPEC Electronics Corp.

Rev. B.4 - Mar., 2008

APL5331

www.anpec.com.tw

23

Classification Reflow Profiles

Profile Feature

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Average ramp-up rate

3

°C/second max.

3

°C/second max.

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (min to max) (ts)

100

°C

150

°C

60-120 seconds

150

°C

200

°C

60-180 seconds

Time maintained above:

183

°C

60-150 seconds

217

°C

60-150 seconds

Peak/Classification Temperature (Tp)

See table 1

See table 2

Time within 5

°C of actual

Peak Temperature (tp)

10-30 seconds

20-40 seconds

Ramp-down Rate

6

°C/second max.

6

°C/second max.

Time 25

°C to Peak Temperature

6 minutes max.

8 minutes max.

Note: All temperatures refer to topside of the package. Measured on the body surface.

Table 2. Pb-free Process – Package Classification Reflow Temperatures

Package Thickness

Volume mm

3

<350

Volume mm

3

350-2000

Volume mm

3

>2000

<1.6 mm

260 +0

°C*

260 +0

°C*

260 +0

°C*

1.6 mm – 2.5 mm

260 +0

°C*

250 +0

°C*

245 +0

°C*

≥2.5 mm

250 +0

°C*

245 +0

°C*

245 +0

°C*

* Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated

classification temperature (this means Peak reflow temperature +0

°C. For example 260°C+0°C) at the rated MSL

level.

Customer Service

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures

Package Thickness

Volume mm

3

<350

Volume mm

3

≥350

<2.5 mm

240 +0/-5

°C

225 +0/-5

°C

≥2.5 mm

225 +0/-5

°C

225 +0/-5

°C

Anpec Electronics Corp.

Head Office :

No.6, Dusing 1st Road, SBIP,

Hsin-Chu, Taiwan, R.O.C.

Tel : 886-3-5642000

Fax : 886-3-5642050

Taipei Branch :

2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,

Sindian City, Taipei County 23146, Taiwan

Tel : 886-2-2910-3838

Fax : 886-2-2917-3838