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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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RC2012 датащи(PDF) 34 Page - Samsung semiconductor |
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RC2012 датащи(HTML) 34 Page - Samsung semiconductor |
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34 / 40 page  Characteristics Performance Direct Current Resistance Within the regulated resistance tolerance. Less than ±(1%+0.1 Ω) of the initial value. Less than ±(3%+0.1 Ω) of the initial value. No evidence of mechanical damage. No evidence of mechanical damage. No evidence of mechanical damage. Over 1,000M Ω Temperature Characteristic Short-time Overload Intermittent Overload Dielectric Withstanding Voltage Insulation Resistance ΔR ΔR Visual Visual J-Grade 1 Ω≤R〈10Ω:+300/-200ppm/℃ 10 Ω≤R≤1MΩ:±100ppm/℃(0603±250ppm) 1M Ω〈R≤10MΩ:±300ppm/℃ F-Grade 1 Ω≤R≤10MΩ:±100ppm/℃(0603±250ppm) 50m ΩMax. 50m ΩMax. 50m ΩMax. JIS C 5201-1 4.5 Voltage apply Within 5 sec. Test temp: 20 ℃, 65RH Test board: <FIG. 1> JIS C 5201-1 4.8 Test Temperature( ℃) 20 ℃→ -55℃ / 20℃→ 125℃ T.C.R(ppm / ℃)=(R-R20)/ R20×1/(T-T20)×106 ※ T=test Temperature, T20 =20 ℃ R=Resistance at T, R20 =Resistane at T20 Test board: <FIG. 1> JIS C 5201-1 4.13 Apply 2.5 times rated voltage for 5 sec. Wait 60 minutes at room temperature. Measure the resistance value. Test board: <FIG. 1> JIS C 5201-1 4.13 2.5 times of rated voltage . 1 second ON, 25 second OFF. 10,000 cycles. Test board: <FIG. 1> JIS C 5201-1 4.7 Apply Voltage for 1 minute 0402.0603:50V 1005, 1608: 100V Other: 500V Max Surge Current Max Surge Current Cu Item Requirements Specification Test Methods Resistor Resistor Jumper Jumper Cu P2 Cu Substrate V Solderability Coverage: ≥95% each termination. No crack of termination parts and ceramic exposure of surface by melting. Less than±(0.5%+0.05 Ω)of the initialvalue. Less than±(1%+0.05 Ω)of the initial value. Less than±(1%+0.05 Ω)of the initial value. No evidence of mechanical damage. No evidence of mechanical damage. No evidence of mechanical damage. Bending Test Adhesive strength of termination No mechanical damage or sign of disconnection JIS C 5201-1(4.16) - Test strengh : 5N (500g . f), 0603 : 2N - Test time : Applying pressure for 10 seconds Resistance to Soldering Heat Anti- Vibration Test ΔR ΔR ΔR Visual Visual Visual 50m ΩMax. 50m ΩMax. 50m ΩMax. IEC60068-2-58 Rosin Flux: Rosin 25%, Methanol 75% Solder Temp.: 245+5/-0 ℃ Dipping time: 2±0.5 sec.(Both side dipping) JIS C 5201-1 4.33 After soldering resistor on the PCB, 3mm of bending shall be applied for 10 sec. Test board: <FIG. 2> JIS C 5201-1 4.18 - Flow soldering :260±5℃,10 sec .max.(both side dipping) - Reflow soldering :260±5℃, 10 sec. max. over 230 ℃, 30~40 sec. JIS C 5201-1 4.22 2 hours each in X, Y and Z axis(total 6 hours) 10 to 55Hz sweep in 1 minute at 1.5mm amplitude. Item Requirements Specification Test Methods Resistor Resistor Jumper Jumper R230 20 3mm 500 g.f 90mm Electrical Characteristic Mechanical Characteristic |
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