TGP-751 datasheet(6/19 Pages) ETC2

6 / 19 page

Micropelt - preliminary - Datasheet TE-CORE v2.5 | Page 6

Thermoharvesting Module

Micropelt TE-CORE

1.7 Absolute Maximum Ratings

Please ensure that during operation of the TE-CORE

module the below maximum ratings are not exceeded:

1.8 Mechanical and Thermal Interfaces

The PCB and the heatsink are connected by two fas-

tening screws, which fixes the TPG at the same time.

Clamping force is max. 25 cNm, because of PCB.

(see TE-CORE exploded view)

Between TGP and the heatsink a Graphite foil ensures a

good thermal path. It is used eGraph type Hitherm

2505 with 127µm as thermal interface material.

1.9 Available Versions

The TE-CORE Thermoharvesting Module is available in

two variations, differentiated by two types of TGP:



TE-CORE7: TGP-751 containing TEG MPG-D751



TE-CORE6: TGP-651 containing TEG MPG-D651

Select TE-CORE7 over TE-

CORE6 for:



Operation at lower temperature gradients



Higher output power with better heatsink;

—> 2x power over the TE-CORE6 is possible.

TE-CORE exploded view

TGP package, ready for SMD assembly

1.6 Modular Thermo-Mechanical Design

The Micropelt TE-CORE Thermoharvesting module

operates from a heat (or cold) thermal energy source.

The TGP’s aluminum top side, its thermal input, is sup-

posed be attached to the heat source. The thickness of

the thermal input acts as a spacer to protect the PCB

on one hand and to ensure a thermal separation be-

tween the hot and cold sides on the other, optimizing

energy harvesting performance through suppression

of thermal ‘cross talk’.

The thickness of the TGP’s thermal output was chosen

to provide an initial heat spreading effect towards a

heat sink and at the same time allowing for population

of electronic components next to the TGP, even below

the heatsink which usually extends well over the foot-

print of the TGP.

Exchangeable

heatsink

Heatsink interface/

thermal output

Heat source interface/

thermal input

DC booster and

power management

min

TYP

max

Hot side

temperature

+ 10 °C

+ 100 ºC

Ambient temp

0 ºC

+ 85 ºC

Storage temp

- 20 ºC

+ 120 ºC

ESD sensitivity

9000 V

TE-CORE7

TE-CORE6

32.5 ºC

90.5 °F

34.0 ºC

93.2 °F

DC-DC startup at

25 °C ambient

Fastening screws for

heat sink

TGP-751 датащи(PDF) 6 Page - List of Unclassifed Manufacturers

TGP-751 датащи(HTML) 6 Page - List of Unclassifed Manufacturers

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

датащи скачать

ссылки URL