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TDA8950J датащи(PDF) 21 Page - NXP Semiconductors

номер детали TDA8950J
подробное описание детали  2 쨈 150 W class-D power amplifier
PDF  39 Pages
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производитель  PHILIPS [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

TDA8950J датащи(HTML) 21 Page - NXP Semiconductors

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TDA8950_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 11 June 2009
21 of 39
NXP Semiconductors
TDA8950
2
× 150 W class-D power amplifier
The most effective way to avoid pumping effects is to connect the TDA8950 in a mono
full-bridge configuration. In the case of stereo single-ended applications, it is advised to
connect the inputs in anti-phase (see Section 8.4). The power supply can also be
adapted; for example, by increasing the values of the supply line decoupling capacitors.
13.7 Application schematic
Notes on the application schematic:
Connect a solid ground plane around the switching amplifier to avoid emissions
Place 100 nF capacitors as close as possible to the TDA8950 power supply pins
Connect the heatsink to the ground plane or to VSSPn using a 100 nF capacitor
Use a thermally conductive, electrically non-conductive, Sil-Pad between the
TDA8950 heat spreader and the external heatsink
The heat spreader of the TDA8950 is internally connected to VSSD
Use differential inputs for the most effective system level audio performance with
unbalanced signal sources. In case of hum due to floating inputs, connect the
shielding or source ground to the amplifier ground.



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