MMBZXVCL_MMBZXVDL_SER_1

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 01 — 3 September 2008

5 of 15

NXP Semiconductors

MMBZxVCL; MMBZxVDL series

Double ESD protection diodes for transient overvoltage suppression

6.

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

[3]

Soldering point at pin 3.

Table 8.

ESD standards compliance

Standard

Conditions

Per diode

IEC 61000-4-2; level 4 (ESD)

> 15 kV (air); > 8 kV (contact)

MIL-STD-883; class 3 (human body model)

> 8 kV

Fig 1.

10/1000

µs pulse waveform according to

IEC 61643-321

Fig 2.

ESD pulse waveform according to

IEC 61000-4-2

0

4.0

3.0

1.0

2.0

006aab319

50

100

150

(%)

0

001aaa631

100 %

90 %

t

30 ns

60 ns

10 %

Table 9.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Per device

thermal resistance from junction

to ambient

in free air

[1] -

-

350

K/W

[2] -

-

280

K/W

thermal resistance from junction

to solder point

[3] --60

K/W