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EP2C50 датащи(PDF) 13 Page - Altera Corporation

номер детали EP2C50
подробное описание детали  Package Information Datasheet for Mature Altera Devices
PDF  182 Pages
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производитель  ALTERA [Altera Corporation]
домашняя страница  http://www.altera.com
Logo ALTERA - Altera Corporation

EP2C50 датащи(HTML) 13 Page - Altera Corporation

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Package Information Datasheet for Mature Altera Devices
13
Device and Package Cross Reference
© December 2011
Altera Corporation
Package Information Datasheet for Mature Altera Devices
APEX II Devices
Table 13 lists the device name, package type, and number of pins for the APEX II
device family.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
APEX 20KE Devices
Table 14 lists the device name, package type, and number of pins for the APEX 20KE
device family.
1 The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Table 13. APEX II Devices
Device
Package
Pins
EP2A15
Dual-Piece Lid: FBGA, Flip Chip, Option 1
672
Dual-Piece Lid: BGA, Flip Chip
724
EP2A25
Channel Lid: FBGA, Flip Chip, Option 1
672
Dual-Piece Lid: BGA, Flip Chip
724
Dual-Piece Lid: FBGA, Flip Chip, Option 1
1020
EP2A40
Channel Lid: FBGA, Flip Chip, Option 1
672
Dual-Piece Lid: BGA, Flip Chip
724
Dual-Piece Lid: FBGA, Flip Chip, Option 1
1020
EP2A70
Dual-Piece Lid: BGA, Flip Chip
724
Dual-Piece Lid: FBGA, Flip Chip, Option 1
1508
Table 14. APEX 20KE Devices (Part 1 of 2)
Device
Package
Pins
EP20K30E
FBGA, Wire Bond
144
TQFP, Wire Bond
144
PQFP, Wire Bond
208
FBGA, Wire Bond, Option 1
324
EP20K60E
FBGA, Wire Bond
144
TQFP, Wire Bond
144
PQFP, Wire Bond
208
PQFP, Wire Bond
240
FBGA, Wire Bond, Option 1
324
BGA, Wire Bond
356



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