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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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EP2C50 датащи(PDF) 91 Page - Altera Corporation |
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EP2C50 датащи(HTML) 91 Page - Altera Corporation |
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91 / 182 page  Package Information Datasheet for Mature Altera Devices 91 © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices 256-Pin Plastic Ball-Grid Array (BGA), Option 2—Wire Bond ■ All dimensions and tolerances conform to ASME Y14.5M - 1994. ■ Controlling dimension is in millimeters. ■ Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on package surface. Package Information Description Specification Ordering Code Reference B Package Acronym BGA Substrate Material BT Solder Ball Composition Regular: 63Sn:37Pb (Typ.) Pb-free: Sn:3Ag:0.5Cu (Typ.) JEDEC Outline Reference MS-034 Variation: BAL-2 Lead Coplanarity 0.008 inches (0.20 mm) Weight 2.2 g (Typ.) Moisture Sensitivity Level Printed on moisture barrier bag Package Outline Dimension Table Symbol Millimeters Min. Nom. Max. A — — 2.60 A1 0.35 — — A2 — — 2.20 A3 — — 1.80 D 27.00 BSC E 27.00 BSC b 0.60 0.75 0.90 e 1.27 BSC |
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