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M24256-BFDW6TP датащи(PDF) 32 Page - STMicroelectronics |
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M24256-BFDW6TP датащи(HTML) 32 Page - STMicroelectronics |
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32 / 40 page ![]() Package mechanical data M24256-BW M24256-BR M24256-BF M24256-DR M24256-DF 32/40 Doc ID 6757 Rev 30 9 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 15. TSSOP8 – 8-lead thin shrink small outline, package outline 1. Drawing is not to scale. Table 18. TSSOP8 – 8-lead thin shrink small outline, package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to four decimal digits. Typ. Min. Max. Typ. Min. Max. A 1.200 0.0472 A1 0.050 0.150 0.0020 0.0059 A2 1.000 0.800 1.050 0.0394 0.0315 0.0413 b 0.190 0.300 0.0075 0.0118 c 0.090 0.200 0.0035 0.0079 CP 0.100 0.0039 D 3.000 2.900 3.100 0.1181 0.1142 0.1220 e 0.650 0.0256 E 6.400 6.200 6.600 0.2520 0.2441 0.2598 E1 4.400 4.300 4.500 0.1732 0.1693 0.1772 L 0.600 0.450 0.750 0.0236 0.0177 0.0295 L1 1.000 0.0394 α 0° 8° 0° 8° |
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