LM3263 datasheet(4/39 Pages) TI

4 / 39 page

LM3263

SNVS837 – JUNE 2013

www.ti.com

ABSOLUTE MAXIMUM RATINGS

(1) (2)

VBATT Pins to GND (PVIN, SVDD, PACB to PGND, SGND, BGND)

−0.2V to +6.0V

FB, SW, GPO1, ACB, VIO, SDATA, SCLK

(GND-0.2V) to (VIN+0.2V) w/ 6.0V max

Continuous power dissipation

Internally Limited

(3)

Maximum operating junction temperature (TJ-MAX)

+150°C

Storage temperature range

−65°C to +150°C

Maximum lead temperature

(Soldering 10 sec.)

+260°C

ESD rating(4) (5)

Human Body Model

1kV

Charged-Device Model

250V

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pins.

(3)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and

disengages at TJ = 125°C (typ.).

(4)

The Human Body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin. (MIL-STD-883 3015.7)

(5)

Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper ESD

handling procedure can result in damage.

OPERATING RATINGS

(1)

Input voltage range PVIN, SVDD, PACB

2.7V to 5.5V

Input voltage range VIO

1.65V to 1.95V

Recommended current load

0 to 2.5A

Junction temperature (TJ) range

−30°C to +125°C

Ambient temperature (TA) range

(2)

−30°C to +90°C

(1)

All voltages are with respect to the potential at the GND pins.

(2)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be de-rated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). At higher power levels duty

cycle usage is assumed to drop (i.e., max power 12.5% usage is assumed) for GSM/GPRS mode.

THERMAL PROPERTIES

Junction-to-Ambient Thermal Resistance (

θJA), YFQ16 Package

(1)

50°C/W

(1)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design. Junction-to-ambient thermal resistance (

θJA)

is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the JEDEC standard JESD51-7 and

is board-dependent.

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