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ROCHESTER5 датащи(PDF) 9 Page - Rochester Electronics

номер детали ROCHESTER5
подробное описание детали  A Rochester Electronics White Paper
PDF  15 Pages
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производитель  ROCHESTER [Rochester Electronics]
домашняя страница  http://www.rocelec.com/
Logo ROCHESTER - Rochester Electronics

ROCHESTER5 датащи(HTML) 9 Page - Rochester Electronics

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© 2011 Rochester Electronics, LLC
Page 9
September 2011
All Rights Reserved
 
simply falsify conformance documentation and sell less-expensive illegal parts to unsuspecting buyers.
Counterfeiters also falsify certificates of conformance and safety approval documentation. Documentation
can also claim that parts have been tested or screened to a higher standard than is true; for example,
commercial parts can be sold as military grade.
“Stretching” a certificate of compliance: Unauthorized source will purchase a small quantity of
legitimate components from an authorized source. The components come with a totally legitimate
certificate of compliance. Then the unauthorized source purchases a much larger quantity of the same
components from an unauthorized source. The “good” and the “bad” components are mixed together and
sold under false pretences using the certificate of compliance that covers only a small percentage of the
total “order.”
It’s not always easy to detect a counterfeit or substandard part.
One of the treacherous aspects of counterfeit and substandard semiconductor devices is that they are not easy to
identify, especially as components become smaller and more complex. The smaller the device, the more difficult it
is to use sophisticated marking techniques.
Inspection protocols can be applied to determine authenticity; however, because there are so many different
counterfeiting methods and variations within those methods, definitive authenticity verification is not easy to
achieve.
Parts can be tested for quality and reliability; however, there are some caveats. The accuracy and usefulness of
test results are dictated by the quality of the test. The only reliable tests are tests done with the exact same test
protocols, equipment, and specifications used by the original component manufacturer. Unauthorized distributors
and third-party test houses do not have access to this intellectual property (IP). Poorly conceived, inadequate test
protocols do not result in accurate results. Only highly trained, experienced engineers have the skill and
knowledge necessary to select and implement the proper test methodologies for each component. In addition,
there is a difference between quality and reliability testing, though both are important in analyzing and projecting
the life cycle performance of a semiconductor. Quality is the ability of the device to perform its specified function
under specified conditions when it is first used. Reliability is the ability of the device to perform its specified
function under specified conditions for a stated period of time.
In most cases, testing adds additional cost to the purchase price of a component. The overall cost of testing must
balance with the required quality and reliability level for the end-use of the component. Cost of testing by
independent and third-party test labs are frequently dictated by competition and the demand for quick turnaround
times; and cost-cutting shortcuts can negatively impact the quality of the test process.
Basically, there are three main types of testing that can be applied to check authenticity, quality, and reliability :
• Visual Inspection: Check paperwork for authenticity. Check the appearance of the device and the
packaging. Pay particular attention to logos, surface textures, and inconsistencies in date and lot codes.
For example, sometimes information can be gained by testing markings with solvents. It is helpful to be
able to compare suspect parts to known authentic parts. If there are aspects that just don’t seem “right,” it
may be that only the original manufacturer can confirm authenticity. The original manufacturer can verify
the date and lot code markings, certificate of conformity, and layout and assembly materials. X-ray
inspection may reveal the presence and size of the die, whether it is the correct one and whether it is
authentic, and the layout and condition of the bond wire. Visual inspection cannot identify damage caused
by improper handling, shipping, and storage, or exposure to electrostatic discharge.



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