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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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PRF18BE471RB5RB датащи(PDF) 97 Page - Murata Manufacturing Co., Ltd. |
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PRF18BE471RB5RB датащи(HTML) 97 Page - Murata Manufacturing Co., Ltd. |
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97 / 104 page  !Caution/Notice Continued from the preceding page. Allowable Reflow Soldering Temp. and Time (2) Adhesive Application and Curing (a) If insufficient adhesive is applied, or if the adhesive is not sufficiently hardened, this product may have a loose contact with the land, during flow soldering. (b) Too low viscosity of adhesive causes this product to slip on the board, after mounting. (3) Allowable Soldering Temperature and Time (a) Solder within the temperature and time combinations, indicated by the slanted lines in the following graphs. (b) Excessive soldering conditions may cause dissolution of metallization or deterioration of solder-wetting on the external electrode. (c) In the case of repeated soldering, the accumulated soldering time should be within the range shown in the figures below. (For example, Reflow peak temperature: 260°C, twice –> The accumulated soldering time at 260°C is within 30sec.) (4) Recommendable Temperature Profile for Soldering (a) Insufficient preheating may cause a crack on the ceramic body. The difference between preheating temperature and maximum temperature in the profile should be 100°C. (b) Rapid cooling by dipping in solvent or by other means is not recommended. (5) There may be a risk of unexpected failures (tombstone, insufficient solder-wetting, etc.) in the mounting process caused by mounting conditions. Please make sure that this product is correctly mounted under the specified mounting conditions. Soldering Gradual cooling (in air) Preheating (in air) 1 to 2 min. 200 100 0 250°C Flow Soldering Conditions * In the case of repeated soldering, the accumulated soldering time should be within the range shown in "(3) Allowable Soldering Temperature and Time." *3 sec. Preheating: 150±10°C, 1-2 minutes. Soldering: 250°C, 3 sec. Soldering Gradual cooling (in air) Preheating (in air) 1 to 2 min. 200 100 0 250°C Reflow Soldering Conditions * In the case of repeated soldering, the accumulated soldering time should be within the range shown in "(3) Allowable Soldering Temperature and Time." *20 sec. Preheating: 150±10°C, 1-2 minutes. Soldering: 250°C, 20 sec. Time (sec.) 010 20 30 260 250 270 240 230 220 210 200 Allowable Flow Soldering Temp. and Time 280 270 260 250 240 230 220 210 0 110 90 20 30 40 50 60 70 100 80 10 Time (sec.) R90E.pdf Sep.24,2012 95 !Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. • This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. |
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