AD7849BN datasheet(4/15 Pages) AD

4 / 15 page

REV. B

–4–

AD7849

ABSOLUTE MAXIMUM RATINGS

(TA = +25

°C unless otherwise noted)

VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.4 V to +17 V

VCC to DGND

. . . . . . . . . . . . . . . . . . –0.4 V, VDD + 0.4 V or

+7 V (Whichever Is Lower)

VSS to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.4 V to –17 V

VREF+ to DGND . . . . . . . . . . . . . . . . VDD + 0.4 V, VSS – 0.4 V

VREF– to DGND . . . . . . . . . . . . . . . . VDD + 0.4 V, VSS – 0.4 V

VOUT to DGND

. . . . . . . . . . . . . . VDD + 0.4 V, VSS – 0.4 V or

±10 V (Whichever Is Lower)

ROFS to DGND . . . . . . . . . . . . . . . . . VDD + 0.4 V, VSS – 0.4 V

Digital Input Voltage to DGND . . . . . . –0.4 V to VCC + 0.4 V

Input Current to any Pin Except Supplies

. . . . . . . . .

±10 mA

Operating Temperature Range

Commercial/Industrial (A, B, C Versions). . . . –40

°C to +85°C

Extended (T Version) . . . . . . . . . . . . . . . . –55

°C to +125°C

Storage Temperature Range . . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150

°C

Plastic DIP Package, Power Dissipation . . . . . . . . . . . 875 mW

θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 102°C/W

Lead Temperature (Soldering, 10 secs) . . . . . . . . . . +260

°C

SOP Package, Power Dissipation . . . . . . . . . . . . . . . . . 875 mW

θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 74°C/W

Lead Temperature, Soldering

Vapor Phase (60 secs) . . . . . . . . . . . . . . . . . . . . . . +215

°C

Infrared (15 secs) . . . . . . . . . . . . . . . . . . . . . . . . . +220

°C

Cerdip Package, Power Dissipation . . . . . . . . . . . . . . . 875 mW

JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 71

°C/W

Lead Temperature, Soldering (Soldering 10 secs) . . . 260

°C

NOTES

1Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational sections

of this specification is not implied.

Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

CC must not exceed VDD by more than 0.4 V. If it is possible for this to happen

during power-up or power-down (for example, if VCC is greater than +0.4 V while

VDD is still 0 V), the following diode protection scheme will ensure protection.

SD103C

1N5711

1N5712

1N4148

VDD

VCC

VDD

VCC

AD7849

OUT may be shorted to DGND, +10 V, –10 V, provided that the power dissipation

of the package is not exceeded.

4Transient currents of up to 100 mA will not cause SCR latch-up.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the AD7849 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

ORDERING GUIDE

Temperature

Resolution

Bipolar

Package

Model

Range

(Bits)

INL (LSBs)

Option

AD7849AN

–40

°C to +85°C14

±3

N-20

AD7849BN

–40

°C to +85°C16

±8

N-20

AD7849CN

–40

°C to +85°C16

±4

N-20

AD7849AR

–40

°C to +85°C14

±3

R-20

AD7849BR

–40

°C to +85°C16

±8

R-20

AD7849CR

–40

°C to +85°C16

±4

R-20

AD7849TQ

–55

°C to +125°C16

±8

Q-20

*N = Plastic DIP; R = SOP (Small Outline Package); Q = Cerdip.

PIN CONFIGURATION

TOP VIEW

(Not to Scale)

AD7849

NC = NO CONNECT

VREF+

VDD

VOUT

ROFS

VREF–

VSS

SYNC

RSTIN

RSTOUT

AGND

SCLK

VCC

SDOUT

DCEN

BIN/COMP

DGND

LDAC

SDIN

CLR

WARNING!

ESD SENSITIVE DEVICE

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