MPC5607B datasheet(60/110 Pages) FREESCALE

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MPC5607B Microcontroller Data Sheet, Rev. 6

Electrical characteristics

Freescale Semiconductor

IDDSTDBY2 CC P STANDBY2 mode current

Slow internal RC

oscillator (128 kHz)

running

TA = 25 °C

—

100

µA

DTA =55°C

—

DTA = 85 °C

—

180

700

DTA = 105 °C

—

315

1000

PTA = 125 °C

—

560

1700

IDDSTDBY1 CC T STANDBY1 mode current

Slow internal RC

oscillator (128 kHz)

running

TA = 25 °C

—

µA

DTA =55°C

—

DTA = 85 °C

—

100

350

DTA = 105 °C

—

165

500

DTA = 125 °C

—

280

900

1 V

DD = 3.3 V ± 10% / 5.0 V ± 10%, TA = 40 to 125 °C, unless otherwise specified

2 Running consumption does not include I/Os toggling which is highly dependent on the application. The given value

is thought to be a worst case value with all peripherals running, and code fetched from code flash while modify

operation ongoing on data flash. Notice that this value can be significantly reduced by application: switch off not

used peripherals (default), reduce peripheral frequency through internal prescaler, fetch from RAM most used

functions, use low power mode when possible.

3 Higher current may be sunk by device during power-up and standby exit. Please refer to in-rush average current in

Table 25.

4 RUN current measured with typical application with accesses on both Flash and RAM.

5 Only for the “P” classification: Data and Code Flash in Normal Power. Code fetched from RAM: Serial IPs CAN and

LIN in loop back mode, DSPI as Master, PLL as system clock (4 x Multiplier) peripherals on (eMIOS/CTU/ADC) and

running at max frequency, periodic SW/WDG timer reset enabled.

6 Data Flash Power Down. Code Flash in Low Power. SIRC 128 kHz and FIRC 16 MHz on. 10 MHz XTAL clock.

FlexCAN: instances: 0, 1, 2 ON (clocked but not reception or transmission), instances: 4, 5, 6 clocks gated. LINFlex:

instances: 0, 1, 2 ON (clocked but not reception or transmission), instance: 3 to 9 clocks gated. eMIOS: instance:

0 ON (16 channels on PA[0]–PA[11] and PC[12]–PC[15]) with PWM 20 kHz, instance: 1 clock gated. DSPI:

instance: 0 (clocked but no communication), instance: 1 to 5 clocks gated. RTC/API ON. PIT ON. STM ON. ADC1

OFF. ADC0 ON but no conversion except two analog watchdogs.

7 Only for the “P” classification: No clock, FIRC 16 MHz off, SIRC 128 kHz on, PLL off, HPvreg off,

ULPVreg/LPVreg on. All possible peripherals off and clock gated. Flash in power down mode.

8 When going from RUN to STOP mode and the core consumption is > 6 mA, it is normal operation for the main

regulator module to be kept on by the on-chip current monitoring circuit. This is most likely to occur with junction

temperatures exceeding 125 °C and under these circumstances, it is possible for the current to initially exceed the

maximum STOP specification by up to 2 mA. After entering stop, the application junction temperature will reduce

to the ambient level and the main regulator will be automatically switched off when the load current is below 6 mA.

9 Only for the “P” classification: ULPreg on, HP/LPVreg off, 32 KB RAM on, device configured for minimum

consumption, all possible modules switched off.

10 ULPreg on, HP/LPVreg off, 8 KB RAM on, device configured for minimum consumption, all possible modules

switched off.

Table 27. Power consumption on VDD_BV and VDD_HV (continued)

Symbol

Parameter

Conditions1

Value

Unit

Min

Typ

Max

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